Manuels d'utilisation pour Nxp Semiconductors TDA8752B

Table des matières

• 1. General description

  1
• 2. Features

  1
• 3. Applications

  2
• 4. Quick reference data

  2
• 5. Ordering information

  3
• 6. Block diagram

  4
• 7. Pinning information

  7
  • 7.1 Pinning

    7
  • 7.2 Pin description

    8
• 8. Functional description

  11
  • 8.1 IC analog video inputs

    11
  • 8.2 Clamps

    11
  • 8.3 Variable gain amplifiers

    11
  • 8.4 ADCs

    13
  • 8.5 ADC outputs

    13
  • 8.6 Phase-locked loop

    13
  • 8.7 I2C-bus and 3-wire serial bus interface

    16
• 9. I2C-bus and 3-wire serial bus interfaces

  17
  • 9.1 Register definitions

    17
    • 9.1.1 Offset register

      17
    • 9.1.2 Coarse and fine registers

      18
    • 9.1.3 Control register

      19
    • 9.1.4 VCO register

      19
    • 9.1.5 Divider register

      21
    • 9.1.6 Power-down mode

      21
    • 9.1.7 PHASEA and PHASEB registers

      21
  • 9.2 I2C-bus protocol

    22
  • 9.3 3-wire serial bus protocol

    23
• 10. Limiting values

  24
• 11. Thermal characteristics

  24
• 12. Characteristics

  24
• 13. Application information

  31
• 14. Package outline

  32
• 15. Handling information

  33
• 16. Soldering

  33
  • 16.1 Introduction to soldering surface mount packages

    33
  • 16.2 Reflow soldering

    33
  • 16.3 Wave soldering

    33
  • 16.4 Manual soldering

    34
  • 16.5 Package related soldering information

    34
• 17. Revision history

  35
• 18. Data sheet status

  36
• 19. Definitions

  36
• 20. Disclaimers

  36
• 21. Licenses

  36