Manuel D’UtilisationTable des matières1.0 DDR3 Registered DIMM Ordering Information52.0 Key Features53.0 Address Configuration54.0 x64 DIMM Pin Configurations (Front side/Back Side)65.0 x72 DIMM Pin Configurations (Front side/Back side)76.0 Pin Description87.0 SPD and Thermal Sensor for ECC UDIMMs88.0 Input/Output Functional Description98.1 Address Mirroring Feature108.1.1 DRAM Pin Wiring Mirroring109.0 Function Block Diagram:119.1 1GB, 128Mx64 Module (Populated as 1 rank of x8 DDR3 SDRAMs)119.2 1GB, 128Mx72 Module (Populated as 1 rank of x8 DDR3 SDRAMs)129.3 2GB, 256Mx64 Module (Populated as 2 ranks of x8 DDR3 SDRAMs)139.4 2GB, 256Mx72 ECC Module (Populated as 2 ranks of x8 DDR3 SDRAMs)1410.0 Absolute Maximum Ratings1510.1 Absolute Maximum DC Ratings1510.2 DRAM Component Operating Temperature Range1511.0 AC & DC Operating Conditions1511.1 Recommended DC Operating Conditions (SSTL - 15)1512.0 AC & DC Input Measurement Levels1612.1 AC & DC Logic Input Levels for Single-ended Signals1612.2 VREF Tolerances1712.3 AC & DC Logic Input Levels for Differential Signals1812.3.1 Differential Signals Definition1812.3.2 Differential Swing Requirement for Clock (CK - CK) and Strobe (DQS - DQS)1812.3.3 Single-ended Requirements for Differential Signals1912.3.4 Differential Input Cross Point Voltage2012.4 Slew Rate Definition for Single-ended Input Signals2012.5 Slew Rate Definition for Differential Input Signals2013.0 AC & DC Output Measurement Levels2113.1 Single-ended AC & DC Output Levels2113.2 Differential AC & DC Output Levels2113.3 Single-ended Output Slew Rate2113.4 DIfferential Output Slew Rate2214.0 IDD Specification Definition2314.1 IDD SPEC Table2515.0 Input/Output Capacitance2715.1 Non ECC UDIMM2715.2 ECC UDIMM2716.0 Electrical Characteristics and AC timing2816.1 Refresh Parameters by Device Density2816.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin2816.3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin2816.3.1 Speed Bin Table Notes3117.0 Timing Parameters by Speed Grade3217.1 Jitter Notes3517.2 Timing Parameter Notes3618.0 Physical Dimensions3718.1 64Mbx16 based 64Mx64 Module (1 Rank)3718.2 128Mbx8 based 128Mx64/x72 Module (1 Rank)3818.3 128Mbx8 based 256Mx64/x72 Module (2 Ranks)39Taille: 750 koPages: 39Language: EnglishOuvrir le manuel