Intel Xeon 5080 HH80555KH1094M Scheda Tecnica
Codici prodotto
HH80555KH1094M
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
101
Boxed Processor Specifications
8.3.2.1
1U Passive/2U Active Combination Heat Sink Solution (1U Rack
Passive)
In the 1U configuration it is assumed that a chassis duct will be implemented to provide
sufficient airflow to pass through the heat sink fins. Currently the actual airflow target
is within the range of 15-27 CFM. The duct should be designed as precisely as possible
and should not allow any air to bypass the heat sink (0” bypass) and a back pressure of
0.38 in. H
sufficient airflow to pass through the heat sink fins. Currently the actual airflow target
is within the range of 15-27 CFM. The duct should be designed as precisely as possible
and should not allow any air to bypass the heat sink (0” bypass) and a back pressure of
0.38 in. H
2
O. It is assumed that a 40°C T
LA
is met. This requires a superior chassis
design to limit the T
RISE
at or below 5°C with an external ambient temperature of 35°C.
Following these guidelines will allow the designer to meet Thermal Profile B and
conform to the thermal requirements of the processor.
conform to the thermal requirements of the processor.
8.3.2.2
1U Passive/2U Active Combination Heat Sink Solution (Pedestal
Active)
The active configuration of the combination solution is designed to help pedestal
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
LA
temperature of 40°C depending on the pedestal chassis layout.
Also, while the active thermal solution is designed to mechanically fit into a 2U
volumetric, it may require additional space at the top of the thermal solution to allow
sufficient airflow into the heat sink fan. Therefore, additional design criteria may need
to be considered if this thermal solution is used in a 2U rack mount chassis, or in a
chassis that has drive bay obstructions above the inlet to the fan heat sink. Use of the
active configuration in rackmount chassis is not recommended.
volumetric, it may require additional space at the top of the thermal solution to allow
sufficient airflow into the heat sink fan. Therefore, additional design criteria may need
to be considered if this thermal solution is used in a 2U rack mount chassis, or in a
chassis that has drive bay obstructions above the inlet to the fan heat sink. Use of the
active configuration in rackmount chassis is not recommended.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
8.3.2.3
2U Passive Heat Sink Solution (2U+ Rack or Pedestal)
A chassis duct is required for the 2U passive heat sink. In this configuration the thermal
profile (see
profile (see
) should be followed by supplying 27 CFM of airflow through the
fins of the heat sink with a 0” or no duct bypass and a back pressure of 0.182 in. H
2
O.
The T
LA
temperature of 40°C should be met. This may require the use of superior
design techniques to keep T
RISE
at or below 5°C based on an ambient external
temperature of 35°C.
8.4
Boxed Processor Contents
A direct chassis attach method must be used to avoid problems related to shock and
vibration, due to the weight of the thermal solution required to cool the processor. The
board must not bend beyond specification in order to avoid damage. The boxed
processor contains the components necessary to solve both issues. The boxed
processor will include the following items:
vibration, due to the weight of the thermal solution required to cool the processor. The
board must not bend beyond specification in order to avoid damage. The boxed
processor contains the components necessary to solve both issues. The boxed
processor will include the following items:
• Dual-Core Intel Xeon Processor 5000 series
• Unattached Heat Sink Solution
• 4 screws, 4 springs, and 4 heat sink standoffs (all captive to the heat sink)
• Thermal Interface Material (pre-applied on heat sink)
• Installation Manual
• Intel Branding Logo
• Unattached Heat Sink Solution
• 4 screws, 4 springs, and 4 heat sink standoffs (all captive to the heat sink)
• Thermal Interface Material (pre-applied on heat sink)
• Installation Manual
• Intel Branding Logo