NEC PD17062 Manuale Utente

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The conditions listed below shall be met when soldering the 

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PD17062.

For details of the recommended soldering conditions, refer to our document 

SMD Surface Mount

Technology Manual 

(IEI-1207)

.

Please consult with our sales offices in case any other soldering process is used, or in case soldering is

done under different conditions.

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Symbol

IR35-207-1

VP15-207-2

–

Soldering process

Infrared ray reflow

VPS

Partial heating method

Soldering conditions

Peak package’s surface temperature:  235 ˚C

Reflow time:  30 seconds or less (at 210 ˚C or more)

Maximum allowable number of reflow processes:  1

Exposure limit 

: 7 days (20 hours of pre-baking is required at

125 ˚C afterward.)

Peak package’s surface temperature:  215 ˚C

Reflow time: 40 seconds or less (at 200 ˚C or more)

Maximum allowable number of reflow processes:  2

Exposure limit 

: 7 days (20 hours of pre-baking is required at

125 ˚C afterward.)

<Cautions>

(1) Do not start reflow-soldering the device if its temperature is

higher than the room temperature because of a previous

reflow soldering.

(2) Do not use water for flux cleaning before a second reflow

soldering.

Terminal temperature:  300 ˚C or less

Heat time:  3 seconds or less (for each side of device)

Note Exposure limit before soldering after dry-pack package is opened.

Storage conditions:  Temperature of 25 ˚C and maximum relative humidity at 65% or less

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Wave soldering

(only for leads)

Partial heating method

Soldering process

Soldering conditions

Solder temperature:  260 

°

C or less

Flow time:  10 seconds or less

Terminal temperature:  260 

°

C or less

Heat time:  10 seconds or less