NEC PD78F9488 Manuale Utente

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User’s Manual  U15331EJ4V1UD
 
 
CHAPTER  25   RECOMMENDED  SOLDERING  CONDITIONS 
The 
µ
PD789489 subseries should be soldered and mounted under the following recommended conditions. 
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales 
representative.   
For technical information, see the following website. 
 
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
 
 
 
Table 25-1.  Surface Mounting Type Soldering Conditions (1/3) 
 
 (1) 
µ 
PD789488GC-
×××-8BT:  80-pin plastic QFP (14x14) 
 µ 
PD78F9488GC-8BT:    80-pin plastic QFP (14x14) 
 µ 
PD789489GC-
×××-8BT: 80-pin plastic QFP (14x14) 
Soldering Method 
Soldering Conditions 
Recommended 
Condition Symbol 
Infrared reflow 
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), 
Count: Twice or less 
IR35-00-2 
VPS 
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), 
Count: Twice or less 
VP15-00-2 
Wave soldering 
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once, 
Preheating temperature: 120°C max. (package surface temperature) 
WS60-00-1 
Partial heating 
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) 
– 
Caution  Do not use different soldering methods together (except for partial heating). 
 
(2) 
µ 
PD789488GK-
×××-9EU: 80-pin plastic TQFP (fine pitch) (12x12) 
 µ 
PD78F9488GK-9EU:   80-pin plastic TQFP (fine pitch) (12x12) 
 µ 
PD789489GK-
×××-9EU: 80-pin plastic TQFP (fine pitch) (12x12) 
Soldering Method 
Soldering Conditions 
Recommended 
Condition Symbol 
Interface reflow 
Package peak temperature: 235
°C, Time:30 seconds max. (at 210°C or higher), 
Count: Twice or less, Exposure limit: 7 days
Note
 (after that, prebake at 125
°C for 
10 hours) 
IR35-107-2 
VPS 
Package peak temperature: 215
°C, Time:40 seconds max. (at 200°C or higher), 
Count: Twice or less, Exposure limit: 7 days
Note
 (after that, prebake at 125
°C for 
10 hours) 
VP15-107-2 
Partial heating 
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row) 
− 
Note   After opening the dry peak, store it at 25
°C or less and 65% RH or less for the allowable storage period. 
 
Caution   Do not use different soldering methods together (except for partial heating).