Intel Xeon Wolfdale E3210 P4X-UPE3210-316-6M1333 Scheda Tecnica
Codici prodotto
P4X-UPE3210-316-6M1333
Datasheet
33
Signal Description
2.6
Direct Media Interface
CL_PWROK
I/O
SSTL
CL Power OK: When asserted, CL_PWROK is an indication to
the MCH that core power (VCC_CL) has been stable for at least
10 us.
the MCH that core power (VCC_CL) has been stable for at least
10 us.
EXP_SLR
I
CMOS
PCI Express* Static Lane Reversal/Form Factor
Selection: MCH’s PCI Express lane numbers are reversed to
differentiate BTX and ATX form factors
0 = MCH PCI Express lane numbers are reversed (BTX)
1 = Normal operation (ATX)
Selection: MCH’s PCI Express lane numbers are reversed to
differentiate BTX and ATX form factors
0 = MCH PCI Express lane numbers are reversed (BTX)
1 = Normal operation (ATX)
BSEL[2:0]
I
CMOS
Bus Speed Select: At the de-assertion of PWROK, the value
sampled on these pins determines the expected frequency of
the bus.
sampled on these pins determines the expected frequency of
the bus.
PWROK
I/O
SSTL
Power OK: When asserted, PWROK is an indication to the MCH
that core power has been stable for at least 10 us.
that core power has been stable for at least 10 us.
ICH_SYNCB
O
HVCMOS
ICH Sync: This signal synchronizes the MCH with the ICH.
ALLZTEST
I
GTL+
All Z Test: This signal is used for chipset Bed of Nails testing to
execute All Z Test. It is used as output for XOR Chain testing.
execute All Z Test. It is used as output for XOR Chain testing.
XORTEST
I
GTL+
XOR Chain Test: This signal is used for chipset Bed of Nails
testing to execute XOR Chain Test.
testing to execute XOR Chain Test.
TEST[3:0]
I/O
A
In Circuit Test: These pins should be connected to test points
on the motherboard. They are internally shorted to the package
ground and can be used to determine if the corner balls on the
MCH are correctly soldered down to the motherboard. These
pins should NOT connect to ground on the motherboard. If
TEST[3:0] are not going to be used, they should be left as no
connects.
on the motherboard. They are internally shorted to the package
ground and can be used to determine if the corner balls on the
MCH are correctly soldered down to the motherboard. These
pins should NOT connect to ground on the motherboard. If
TEST[3:0] are not going to be used, they should be left as no
connects.
Signal Name
Type
Description
DMI_RXP_[3:0]
DMI_RXN_[3:0]
DMI_RXN_[3:0]
I
DMI
Direct Media Interface: Receive differential pair (RX). MCH-
ICH serial interface input
ICH serial interface input
DMI_TXP_[3:0]
DMI_TXN_[3:0]
DMI_TXN_[3:0]
O
DMI
Direct Media Interface: Transmit differential pair (TX).
MCH-ICH serial interface output
MCH-ICH serial interface output
Signal Name
Type
Description