Lenovo Intel Xeon E5520 67Y0011 Manuale Utente
Codici prodotto
67Y0011
Thermal/Mechanical Design Guide
15
LGA1366 Socket
2.1
Board Layout
The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size
is 18 mils. Note that there is no round-off (conversion) error between socket pitch
(1.016 mm) and board pitch (40 mil) as these values are equivalent.
is 18 mils. Note that there is no round-off (conversion) error between socket pitch
(1.016 mm) and board pitch (40 mil) as these values are equivalent.
Figure 2-3. LGA1366 Socket Land Pattern (Top View of Board)
A
C
E
G
J
L
N
R
U
W
AA AC AE AG AJ
AL AN AR AU AW BA
B
D
F
H
K
M
P
T
V
Y
AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
31
29
1
3
7
5
9
11
15
13
17
19
23
21
25
27
31
29
2
8
4
6
10
16
12
14
18
24
20
22
26
32
28
30
2
8
4
6
10
16
12
14
18
24
20
22
26
32
28
30
16
12
15
13
14
17
18
24
20
19
23
21
22
25
26
32
28
27
31
29
30
33
34
40
36
35
39
37
38
41
42
43
B
D
F
H
K
M
P
T
V
Y
AB AD AF AH AK AM AP AT AV AY
A
C
E
G
J
L
N
R
U
W
AA AC AE AG AJ
AL AN AR AU AW BA