Lenovo Intel Xeon E5520 67Y0011 Manuale Utente
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67Y0011
Thermal/Mechanical Design Guide
17
LGA1366 Socket
The co-planarity (profile) and true position requirements are defined in
.
2.3.3
Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 μm
[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in the LGA1366 Socket Validation Reports without degrading.
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in the LGA1366 Socket Validation Reports without degrading.
As indicated in
, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in
in
, a Pin1 indicator on the cover provides a visual reference for proper
orientation with the socket.
Figure 2-5. Pick and Place Cover
Pin 1
Pin 1
Pick and
Place Cover
ILM
Installation