Lenovo Intel Xeon E5520 67Y0011 Manuale Utente

Thermal/Mechanical Design Guide

27

This chapter describes the electrical, mechanical, and environmental specifications for 
the LGA1366 socket and the Independent Loading Mechanism.

 provides the stackup height of a processor in the 1366-land LGA package and 

LGA1366 socket with the ILM closed and the processor fully seated in the socket.

1.

This data is provided for information only, and should be derived from: (a) the height of the socket seating 

plane above the motherboard after reflow, given in 

, (b) the height of the package, from the 

package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that 

are given in the corresponding processor EMTS.

2.

This value is a RSS calculation.

The power dissipated within the socket is a function of the current at the pin level and 
the effective pin resistance. To ensure socket long term reliability, Intel defines socket 
maximum temperature using a via on the underside of the motherboard. Exceeding the 
temperature guidance may result in socket body deformation, or increases in thermal 
and electrical resistance which can cause a thermal runaway and eventual electrical 
failure. The guidance for socket maximum temperature is listed below:

• Via temperature under socket < 96 °C 

Socket Body, Contacts and PnP Cover

15 gm

ILM Cover

43 gm

ILM Back Plate for dual processor server products

100 gm

Integrated Stackup Height

 

(mm)

From Top of Board to Top of IHS

7.729 ± 0.282 mm