Lenovo Intel Xeon E5520 67Y0011 Manuale Utente
Codici prodotto
67Y0011
Thermal Solutions
34
Thermal/Mechanical Design Guide
5.2
Heat Pipe Considerations
shows the orientation and position of the TTV die. The TTV die is sized and
positioned similarly to the processor die.
Figure 5-2. TTV Die Size and Orientation
Figure 1 - Side Views of Package with IHS (not to scale)
Co
re
1
Co
re 2
Cor
e
3
Core 4
Cache Cache Cache Cache
Un
co
re
Core
Cache
42.5
45
19.3
13
.2
1.0
Package CL
Die CL
NOT TO SCALE
All Dimensions in mm