Lenovo Intel Xeon E5520 67Y0011 Manuale Utente

Thermal/Mechanical Design Guide

35

The assembly process for the 1U reference heatsink begins with application of 
Honeywell PCM45F thermal interface material to improve conduction from the IHS. 
Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm.

Next, position the heatsink such that the heatsink fins are parallel to system airflow. 
While lowering the heatsink onto the IHS, align the four captive screws of the heatsink 
to the four threaded nuts of the back plate. 

Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds.

This assembly process is designed to produce a static load of 39 - 51 lbf, for 0.062" - 
0.100" board thickness respectively. Honeywell PCM45F is expected to meet the 
performance targets in 

 from 30 - 60 lbf. From 

, the Heatsink Static 

Compressive Load of 0 - 60 lbf allows for designs that vary from the 1U reference 
heatsink. Example: A customer’s unique heatsink with very little static load (as little as 
0 lbf) is acceptable from a socket loading perspective as long as the T

CASE

 specification 

is met.

Compliance to Board Keepout Zones in 

 is assumed for this assembly 

process.

1U Reference Heatsink 

Thermal Interface Material:

Honeywell PCM45F 

Captive Screw

IHS: Integrated 

Heat Spreader

Reference Back Plate 

(Unified Back Plate)

Threaded Nut

1U Reference Heatsink 

Thermal Interface Material:

Honeywell PCM45F 

Captive Screw

IHS: Integrated 

Heat Spreader

Reference Back Plate 

(Unified Back Plate)

Threaded Nut