Lenovo Intel Xeon E5520 67Y0011 Manuale Utente

Thermal/Mechanical Design Guide

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Intel tests reference components both individually and as an assembly on mechanical 
test boards, and assesses performance to the envelopes specified in previous sections 
by varying boundary conditions. 

While component validation shows that a reference design is tenable for a limited range 
of conditions, customers need to assess their specific boundary conditions and perform 
reliability testing based on their use conditions. 

Intel reference components are also used in board functional tests to assess 
performance for specific conditions.

Each test sequence should start with components (baseboard, heatsink assembly, and 
so on) that have not been previously submitted to any reliability testing. 

The test sequence should always start with a visual inspection after assembly and 
BIOS/Processor/memory test. The stress test should be then followed by a visual 
inspection and then BIOS/Processor/memory test.

The post-test pass criteria are:

1. No significant physical damage to the heatsink and retention hardware.