Lenovo Intel Xeon E5520 67Y0011 Manuale Utente

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Thermal/Mechanical Design Guide

2. Heatsink remains seated and its bottom remains mated flat against the IHS 

surface. No visible gap between the heatsink base and processor IHS. No visible tilt 
of the heatsink with respect to the retention hardware.

3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test.
6. Thermal compliance testing to demonstrate that the case temperature specification 

can be met.

This test is to ensure proper operation of the product before and after environmental 
stresses, with the thermal mechanical enabling components assembled. The test shall 
be conducted on a fully operational baseboard that has not been exposed to any 
battery of tests prior to the test being considered. 

The testing setup should include the following components, properly assembled and/or 
connected:

• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the 
checking of BIOS, basic processor functions and memory, without any errors. 

Material shall be resistant to fungal growth. Examples of non-resistant materials 
include cellulose materials, animal and vegetable based adhesives, grease, oils, and 
many hydrocarbons. Synthetic materials such as PVC formulations, certain 
polyurethane compositions (for example, polyester and some polyethers), plastics 
which contain organic fillers of laminating materials, paints, and varnishes also are 
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.

Any plastic component exceeding 25 gm should be recyclable per the European Blue 
Angel recycling standards. 

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS 
compliant. 

Lead-free and Pb-free: Lead has not been intentionally added, but lead may still 
exist as an impurity below 1000 ppm. 

RoHS compliant: Lead and other materials banned in RoHS Directive are either 
(1) below all applicable substance thresholds as proposed by the EU or (2) an 
approved/pending exemption applies. 

RoHS implementation details are not fully defined and may change.