Intel Xeon 7130N LF80550KF0878M Scheda Tecnica
Codici prodotto
LF80550KF0878M
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
67
6
Thermal Specifications
6.1
Package Thermal Specifications
The Dual-Core Intel Xeon processor 7000 series requires a thermal solution to maintain
temperatures within operating limits. Any attempt to operate the processor outside these operating
limits may result in permanent damage to the processor and potentially other components within
the system. As processor technology changes, thermal management becomes increasingly crucial
when building computer systems. Maintaining the proper thermal environment is key to reliable,
long-term system operation.
temperatures within operating limits. Any attempt to operate the processor outside these operating
limits may result in permanent damage to the processor and potentially other components within
the system. As processor technology changes, thermal management becomes increasingly crucial
when building computer systems. Maintaining the proper thermal environment is key to reliable,
long-term system operation.
A complete solution includes both component and system level thermal management features.
Component level thermal solutions can include active or passive heatsinks attached to the
processor IHS. Typical system level thermal solutions may consist of system fans combined with
ducting and venting.
Component level thermal solutions can include active or passive heatsinks attached to the
processor IHS. Typical system level thermal solutions may consist of system fans combined with
ducting and venting.
For more information on designing a component level thermal solution, refer to the Dual-Core
Intel
Intel
®
Xeon
®
Processor 7000 Sequence Thermal/Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to
for details on
the boxed processor.
6.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based systems, the
processor must remain within the minimum and maximum case temperature (T
processor must remain within the minimum and maximum case temperature (T
CASE
) specifications
as defined by the applicable thermal profile (see
). Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, please refer to the appropriate
processor thermal/mechanical design guideline.
processor and system. For more details on thermal solution design, please refer to the appropriate
processor thermal/mechanical design guideline.
The Dual-Core Intel Xeon processor 7000 series introduces a new methodology for managing
processor temperatures which is intended to support acoustic noise reduction through fan speed
control and assure processor reliability. Selection of the appropriate fan speed will be based on the
temperature reported by the processor’s Thermal Diode. If the diode temperature is greater than or
equal to Tcontrol (see
processor temperatures which is intended to support acoustic noise reduction through fan speed
control and assure processor reliability. Selection of the appropriate fan speed will be based on the
temperature reported by the processor’s Thermal Diode. If the diode temperature is greater than or
equal to Tcontrol (see
), then the processor case temperature must remain at or below
the temperature as specified by the thermal profile (see
). If the diode temperature is less
than Tcontrol, then the case temperature is permitted to exceed the thermal profile, but the diode
temperature must remain at or below Tcontrol. Systems that implement fan speed control must be
designed to take these conditions into account. Systems that do not alter the fan speed only need to
guarantee the case temperature meets the thermal profile specifications.
temperature must remain at or below Tcontrol. Systems that implement fan speed control must be
designed to take these conditions into account. Systems that do not alter the fan speed only need to
guarantee the case temperature meets the thermal profile specifications.
The Dual-Core Intel Xeon processor 7000 series thermal profile ensures adherence to Intel
reliability requirements. The thermal profile is representative of a volumetrically unconstrained
thermal solution (i.e. industry enabled 2U heatsink). In this scenario, it is expected that the Thermal
Control Circuit (TCC) would only be activated for very brief periods of time when running the
most power intensive applications. Refer to the Dual-Core Intel
reliability requirements. The thermal profile is representative of a volumetrically unconstrained
thermal solution (i.e. industry enabled 2U heatsink). In this scenario, it is expected that the Thermal
Control Circuit (TCC) would only be activated for very brief periods of time when running the
most power intensive applications. Refer to the Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence
Thermal/Mechanical Design Guidelines for details on system thermal solution design, thermal
profiles, and environmental considerations.
profiles, and environmental considerations.