Intel 220 LE80557RE009512 Scheda Tecnica

Datasheet

33

The Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA package 

shown in 

The processor may contain components on the substrate that define component keep-

out zone requirements. A thermal and mechanical solution design must not intrude into 

the required keep-out zones. Decoupling capacitors are typically mounted in the keep-

out areas. The location and quantity of the capacitors may change but will remain 

within the component keep-in. See 

 for keep-out zones.

Maximum mechanical package loading specifications are given in 

. These 

specifications are static compressive loading in the direction normal to the processor. 

This maximum load limit should not be exceeded during shipping conditions, standard 

use condition, or by the thermal solution. In addition, there are additional load 

limitations against transient bend, shock, and tensile loading. These limitations are 

more platform specific and should be obtained by contacting your field support. 

Moreover, the processor package substrate should not be used as a mechanical 

reference or load-bearing surface for the thermal or mechanical solution.