Intel QX9775 EU80574XL088N Scheda Tecnica

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The processor is packaged in a Flip Chip Land Grid Array (FC-LGA) package that 

interfaces to the baseboard via a LGA771 socket. The package consists of a processor 

core mounted on a pinless substrate with 771 lands. An integrated heat spreader (IHS) 

is attached to the package substrate and core and serves as the interface for processor 

component thermal solutions such as a heatsink. 

 shows a sketch of the 

processor package components and how they are assembled together. Refer to the 

LGA771 Socket Design Guidelines for complete details on the LGA771 socket.

The package components shown in 

• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor Core (die)
• Package Substrate
• Landside capacitors
• Package  Lands

NOTE: This drawing is not to scale and is for reference only.

The package mechanical drawings are shown in 

. The 

drawings include dimensions necessary to design a thermal solution for the processor 

including:

• Package reference and tolerance dimensions (total height, length, width, and so 

forth)

• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keepout dimensions
• Reference datums

All drawing dimensions are in mm [in.].