Quectel Wireless Solutions Company Limited 201807EG95NA Manuale Utente

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LTE  Module  Series 
                                                                                                  EG95  Hardware  Design
 
 
EG95_Hardware_Design                                                                                                                              16 / 81 
 
 
 
Application Interfaces 
 
3.1. 
General Description 
 
EG95  is  equipped  with  62-pin  1.1mm  pitch  SMT  pads  plus  44-pin 
ground/reserved  pads  that  can  be 
connected  to  customers
’  cellular  application  platforms.  Sub-interfaces  included  in  these  pads  are 
described in detail in the following chapters: 
 
  Power supply 
  (U)SIM interfaces 
  USB interface 
  UART interfaces 
  PCM and I2C interfaces 
  SPI interface 
  Status indication