AAC Technologies Pte Ltd 357HP Manuale Utente
Module Specification
NO.
AT357HP
TITLE:
Module, ZigBee, 17.9 x 24.9 x 2.75mm, 51 I/O, Edge Castellated, SMD
REVISION DATE:
8 April 2013
ISSUE:
O
PAGE:
21 of 27
5.0
ASSEMBLY INFORMATION
5.1
Lead-Free soldering reflow profile
Condition
Exposure
Average ramp-up rate (200
°C to 250°C)
< 3
°C / second
> 217
°C
60-120 seconds
Peak temperature
250 +0/-5
°C
Time within 5
°C of peak
20-30 seconds
Ramp-down rate (Peak to 50
°C)
Less than 6
°C / second
Table 13: Reflow Profile Recommendation
6.0
RELIABILITY TESTS
No.
Test item
Test condition
1
Reflow Thermal Cycle
Normal Pbfree reflow Condition 2 times
2
Thermal Shock Cycle
30min. at -40
°C
, 30min. at 85
°C
, 100Cycles
Recovery Time 1hours
3
Vibration Test
JESD22-B103-B Service Condition 5,
5Hz -> 500Hz, Acceleration 0.3g, 4min/Cycle.
Total 4 cycles per axis
4
High Temperature Storage Test
96 hours at 85
°C
, Recovery Time 1hours
5
Low Temperature Storage Test
96 hours at -40
°C
, Recovery Time 1hours
6
High Temperature & Humidity
Storage Test
96 hours at 60
°C
& 90%RH±2%RH.
Recovery Time 1hours
7
Drop Test
Height min 76
㎝, All sides onto metal plate
Table 14: Reliability Tests