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UFM 16GB
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Stec UFM 16GB SLUFM16GU2TUI-A Manuale Utente
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SLUFM16GU2TUI-A
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SLUFMxxxU2TU(I)-y Data Sheet
STEC™ Embedded USB Flash Module
61000-07022-108, September 2012
2
Table of Contents
1.0
Introduction .................................................................................................................... 3
2.0
Product Specifications ................................................................................................... 4
2.1
Mechanical Dimensions .......................................................................................................... 4
2.1.1
Standard 2x5 Connector Form Factor .......................................................................... 4
2.1.2
Hirose 9-Pin Connector Form Factor ........................................................................... 5
2.2
Pin Assignment ....................................................................................................................... 6
2.2.1
Standard 2x5 Connector .............................................................................................. 6
2.2.2
Hirose 9-Pin Connector ................................................................................................ 6
2.3
Signal Description ................................................................................................................... 6
2.4
Performance ............................................................................................................................ 6
2.5
Power Consumption ................................................................................................................ 7
3.0
Theory of Operation ....................................................................................................... 7
3.1
Block Diagram ......................................................................................................................... 7
3.1.1
Controller Embedded Components .............................................................................. 7
3.1.2
Controller External Components .................................................................................. 8
3.2
Flash Management.................................................................................................................. 8
3.2.1
Bad Block Management ............................................................................................... 8
3.2.2
Wear Leveling .............................................................................................................. 8
3.2.3
Error Correction ............................................................................................................ 9
3.3
OS and Boot Support .............................................................................................................. 9
3.3.1
Using USB Flash Module with XP Embedded .............................................................. 9
3.4
Unique Serial Number ........................................................................................................... 10
4.0
Environmental Specifications ......................................................................................10
4.1
Recommended Operating Conditions ................................................................................... 10
4.2
Reliability ............................................................................................................................... 10
4.3
Shock, Vibration, and Humidity ............................................................................................. 10
4.4
Electrostatic Discharge (ESD) ............................................................................................... 11
4.5
Mean Time Between Failure (MTBF) .................................................................................... 11
4.6
Standards Compliance .......................................................................................................... 11
5.0
Electrical Specifications ...............................................................................................12
5.1
Absolute Maximum Ratings .................................................................................................. 12
5.2
DC Characteristics ................................................................................................................ 12
5.3
AC Characteristics................................................................................................................. 13
6.0
SCSI Command List ......................................................................................................13
7.0
Evaluating USB Flash Module ......................................................................................14
8.0
Product Marking ............................................................................................................15
9.0
Programmed Vendor and Product Names ...................................................................17
10.0
STEC’s Contact Information .........................................................................................18
10.1
Worldwide Headquarters ....................................................................................................... 18
10.2
Worldwide Locations ............................................................................................................. 18
11.0
Revision History ............................................................................................................19
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