Xi3 Corporation Nuc Lear 910-H8G1-000 Dépliant

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910-H8G1-000
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NUC
Lear
INSTALL EVERYWHERE. MANAGE ANYWHERE.
®
AUDIO
•  Intel High Definition Audio
5
 (Intel HD  
  Audio) via HDMI 1.4a and Display 
  Port 1.1a outputs supporting 8  
  channel (7.1) digital audio 
JUMPERS AND FRONT-PANEL 
CONNECTORS
•  Reset, HDD LED, Power LEDs,  
  power on/off 
•  Front-panel Hi-Speed USB 2.0  
 headers
MECHANICAL CHASSIS SIZE
•  4.59” x 4.41” x 1.55”
•  116.6mm x 112.0mm x 39.0mm 
BOARD SIZE
•  4” x 4”  (101.6mm x 101.6mm) 
BASEBOARD POWER
REQUIREMENTS
•  DC Power 19V, 65W 
ENVIRONMENT OPERATING 
TEMPERATURE
•  32° F to +122° F (0° C to +50° C)
STORAGE TEMPERATURE
•  -4° F to +158° F (-20° C to +70° C)
For a complete listing of regulations, 
safety standards and environmental 
compliance certifications, please visit: 
www.Xi3.com/desktops/Xi3-nuc
PROCESSOR
•  Intel Core i5 3427U Processor (1.8  
  GHz with turbo capability to achieve  
  2.8GHz, Dual-Core processor with  
  3 MB smart cache) 
•  Supports Intel HyperThreading
 Technology 
•  Supports Intel 64 architecture
3
 
CHIPSET
•  Intel QS77 Express Chipset
GRAPHICS
•  Intel HD Graphics 4000 
•  2 Mini DisplayPorts and 1 HDMI port  
  supporting independent triple   
  display capability
STORAGE
•  Integrated SSD storage configura- 
  tions available through Xi3 include  
  80GB, 120GB, 180GB 
SYSTEM MEMORY
•  Dual-channel DDR3 with 2 connec- 
  tors for 1600/1333/1066 MHz  
  memory support (16 GB max)
•  RAM configurations available   
  through Xi3 include 4GB (1 x 4GB),  
  8GB (2 x 4GB) 
MEMORY VOLTAGE
•  1.35V
OPERATING SYSTEM
•  Supports 64-bit, x86-based
  operating systems
•  Integrated operating systems   
  available through Xi3 include    
  Windows 7, Windows 8, openSUSE  
  Linux, Ubuntu
SYSTEM BIOS
•  128Mb Flash EEPROM with Intel  
  Platform Innovation Framework for  
  EFI Plug and Play 
•  Advanced configuration and power  
  interface V3.0b, SMBIOS2.5 
•  Intel Express BIOS update support 
FAST BOOT BIOS
•  Optimized POST for almost    
  instant-on access from power on
PERIPHERAL CONNECTIVITY
•  Integrated Intel 10/100/1000    
  Network Connection 
•  4 Hi-Speed USB 2.0 ports: (2 back  
  panel ports and 2 additional ports  
  via internal header) 
•  1 Super Hi-Speed USB 3.0 front  
  panel port
HARDWARE MANAGEMENT 
FEATURES
•  Processor fan speed control
•  System chassis fan speed control
•  Voltage and temperature sensing
•  Fan senor to monitor fan activity
•  ACPI-compliant power management  
 control
INTEL PRO 10/100/1000 NET-
WORK CONNECTION
•  Low-power design
•  Optional Wi-Fi available through Xi3:   
  802.11 a/b/g/n/ac + Bluetooth 4.0
EXPANSION CAPABILITIES
•  2 mini-PCIe* slots for mSATA and  
  other expansion capabilities
4
•  1 PCIe* half-mini card connector 
•  1 PCIe full-mini card connector
 
1 — Requires two mini DisplayPort capable monitors.
2 — The Intel
®
 CoreTM processor utilities bundle includes Intel
®
 Integrator 
Assistant, Intel
®
 Integrator Toolkit, Intel
®
 Express Installer and Intel
®
 Express 
Bios Update. 
3 — 64-bit computing on Intel
®
 architecture requires a computer system with a 
processor, chipset, BIOS, operating system, device drivers, and applications 
enabled for Intel
®
 64 architecture. Processors will not operate (including 32-bit 
operation) without an Intel 64 architecture-enabled BIOS. Performance will vary 
depending on your hardware and software configurations. See http:// 
developer.intel.com/technology/intel64/index.htm for more information. 
4 — System resources and hardware (such as PCI and PCI Express*) require 
physical memory address locations that can reduce available addressable 
system memory. This could result in a reduction of as much as 1 GB or more of 
physical addressable memory being available to the operating system and 
applications, depending on the system configuration and operating system.
 
5 — Intel
®
 High Definition Audio requires a system with an appropriate Intel® 
chip- set and a motherboard with an appropriate codec and the necessary 
drivers installed. System sound quality will vary depending on actual 
implementation, controller, codec, drivers, and speakers. For more information 
about Intel
®
 HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
 
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH Xi3 
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR 
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY 
THIS DOCUMENT. EXCEPT AS PROVIDED IN Xi3’S TERMS AND CONDITIONS 
OF SALE FOR SUCH PRODUCTS, Xi3 ASSUMES NO LIABILITY 
WHATSOEVER, AND Xi3 DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, 
RELATING TO SALE AND/OR USE OF Xi3 PRODUCTS INCLUDING LIABILITY 
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, 
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR 
OTHER INTELLECTUAL PROPERTY RIGHT.
Xi3 products are not intended for use in life-saving, or life-sustaining 
applications. Xi3 may make changes to specifications and product descriptions 
at any time, without notice. All products, dates, and figures specified are 
preliminary based on current expectations, and are subject to change without 
notice. Actual Xi3 product may differ from the image shown.
Copyright © 2014 Xi3, Inc. All rights reserved. Intel, the Intel logo, Intel Inside, Look Inside, the Look Inside logo, and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others. 
Printed in USA   
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