Листовка для Xi3 Corporation Nuc Lear 910-H8G1-000
Модели
910-H8G1-000
NUC
Lear
INSTALL EVERYWHERE. MANAGE ANYWHERE.
®
AUDIO
• Intel High Definition Audio
5
(Intel HD
Audio) via HDMI 1.4a and Display
Port 1.1a outputs supporting 8
channel (7.1) digital audio
JUMPERS AND FRONT-PANEL
CONNECTORS
• Reset, HDD LED, Power LEDs,
power on/off
• Front-panel Hi-Speed USB 2.0
headers
MECHANICAL CHASSIS SIZE
• 4.59” x 4.41” x 1.55”
• 116.6mm x 112.0mm x 39.0mm
BOARD SIZE
• 4” x 4” (101.6mm x 101.6mm)
BASEBOARD POWER
REQUIREMENTS
• DC Power 19V, 65W
ENVIRONMENT OPERATING
TEMPERATURE
• 32° F to +122° F (0° C to +50° C)
STORAGE TEMPERATURE
• -4° F to +158° F (-20° C to +70° C)
For a complete listing of regulations,
safety standards and environmental
compliance certifications, please visit:
www.Xi3.com/desktops/Xi3-nuc
PROCESSOR
• Intel Core i5 3427U Processor (1.8
GHz with turbo capability to achieve
2.8GHz, Dual-Core processor with
3 MB smart cache)
• Supports Intel HyperThreading
Technology
• Supports Intel 64 architecture
3
CHIPSET
• Intel QS77 Express Chipset
GRAPHICS
• Intel HD Graphics 4000
• 2 Mini DisplayPorts and 1 HDMI port
supporting independent triple
display capability
STORAGE
• Integrated SSD storage configura-
tions available through Xi3 include
80GB, 120GB, 180GB
SYSTEM MEMORY
• Dual-channel DDR3 with 2 connec-
tors for 1600/1333/1066 MHz
memory support (16 GB max)
• RAM configurations available
through Xi3 include 4GB (1 x 4GB),
8GB (2 x 4GB)
MEMORY VOLTAGE
• 1.35V
OPERATING SYSTEM
• Supports 64-bit, x86-based
operating systems
• Integrated operating systems
available through Xi3 include
Windows 7, Windows 8, openSUSE
Linux, Ubuntu
SYSTEM BIOS
• 128Mb Flash EEPROM with Intel
Platform Innovation Framework for
EFI Plug and Play
• Advanced configuration and power
interface V3.0b, SMBIOS2.5
• Intel Express BIOS update support
FAST BOOT BIOS
• Optimized POST for almost
instant-on access from power on
PERIPHERAL CONNECTIVITY
• Integrated Intel 10/100/1000
Network Connection
• 4 Hi-Speed USB 2.0 ports: (2 back
panel ports and 2 additional ports
via internal header)
• 1 Super Hi-Speed USB 3.0 front
panel port
HARDWARE MANAGEMENT
FEATURES
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan senor to monitor fan activity
• ACPI-compliant power management
control
INTEL PRO 10/100/1000 NET-
WORK CONNECTION
• Low-power design
• Optional Wi-Fi available through Xi3:
802.11 a/b/g/n/ac + Bluetooth 4.0
EXPANSION CAPABILITIES
• 2 mini-PCIe* slots for mSATA and
other expansion capabilities
4
• 1 PCIe* half-mini card connector
• 1 PCIe full-mini card connector
1 — Requires two mini DisplayPort capable monitors.
2 — The Intel
®
CoreTM processor utilities bundle includes Intel
®
Integrator
Assistant, Intel
®
Integrator Toolkit, Intel
®
Express Installer and Intel
®
Express
Bios Update.
3 — 64-bit computing on Intel
®
architecture requires a computer system with a
processor, chipset, BIOS, operating system, device drivers, and applications
enabled for Intel
®
64 architecture. Processors will not operate (including 32-bit
operation) without an Intel 64 architecture-enabled BIOS. Performance will vary
depending on your hardware and software configurations. See http://
developer.intel.com/technology/intel64/index.htm for more information.
4 — System resources and hardware (such as PCI and PCI Express*) require
physical memory address locations that can reduce available addressable
system memory. This could result in a reduction of as much as 1 GB or more of
physical addressable memory being available to the operating system and
applications, depending on the system configuration and operating system.
5 — Intel
®
High Definition Audio requires a system with an appropriate Intel®
chip- set and a motherboard with an appropriate codec and the necessary
drivers installed. System sound quality will vary depending on actual
implementation, controller, codec, drivers, and speakers. For more information
about Intel
®
HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH Xi3
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY
THIS DOCUMENT. EXCEPT AS PROVIDED IN Xi3’S TERMS AND CONDITIONS
OF SALE FOR SUCH PRODUCTS, Xi3 ASSUMES NO LIABILITY
WHATSOEVER, AND Xi3 DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY,
RELATING TO SALE AND/OR USE OF Xi3 PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR
OTHER INTELLECTUAL PROPERTY RIGHT.
Xi3 products are not intended for use in life-saving, or life-sustaining
applications. Xi3 may make changes to specifications and product descriptions
at any time, without notice. All products, dates, and figures specified are
preliminary based on current expectations, and are subject to change without
notice. Actual Xi3 product may differ from the image shown.
Copyright © 2014 Xi3, Inc. All rights reserved. Intel, the Intel logo, Intel Inside, Look Inside, the Look Inside logo, and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
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