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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
89
Boxed Processor Specifications
8
Boxed Processor Specifications
8.1
Introduction
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Dual-Core Intel
components available through distribution channels. The Dual-Core Intel
®
Xeon
®
Processor 5000 series will be offered as an Intel boxed processor.
Intel will offer the Dual-Core Intel Xeon Processor 5000 series boxed processor with
two heat sink configurations available for each processor frequency: 1U passive/2U
active combination solution and a 2U passive only solution. The 1U passive/2U active
combination solution is based on a 1U passive heat sink with a removable fan that will
be pre-attached at shipping. This heat sink solution is intended to be used as either a
1U passive heat sink or a 2U+ active heat sink. Although the active combination
solution with removable fan mechanically fits into a 2U keepout, additional design
considerations may need to be addressed to provide sufficient airflow to the fan inlet.
two heat sink configurations available for each processor frequency: 1U passive/2U
active combination solution and a 2U passive only solution. The 1U passive/2U active
combination solution is based on a 1U passive heat sink with a removable fan that will
be pre-attached at shipping. This heat sink solution is intended to be used as either a
1U passive heat sink or a 2U+ active heat sink. Although the active combination
solution with removable fan mechanically fits into a 2U keepout, additional design
considerations may need to be addressed to provide sufficient airflow to the fan inlet.
The 1U passive/2U active combination solution in the active fan configuration is
primarily designed to be used in a pedestal chassis where sufficient air inlet space is
present and strong side directional airflow is not an issue. The 1U passive/active
combination solution with the fan removed and the 2U passive thermal solution require
the use of chassis ducting and are targeted for use in rack mount servers. The
retention solution used for these products is called the Common Enabling Kit, or CEK.
The CEK base is compatible with both thermal solutions and uses the same hole
locations as the Intel® Xeon® processor with 800 MHz FSB.
primarily designed to be used in a pedestal chassis where sufficient air inlet space is
present and strong side directional airflow is not an issue. The 1U passive/active
combination solution with the fan removed and the 2U passive thermal solution require
the use of chassis ducting and are targeted for use in rack mount servers. The
retention solution used for these products is called the Common Enabling Kit, or CEK.
The CEK base is compatible with both thermal solutions and uses the same hole
locations as the Intel® Xeon® processor with 800 MHz FSB.
The 1U passive/active combination solution will utilize a removable fan with a 4-pin
pulse width modulated (PWM) T-diode control. Use of a 4-pin PWM T-diode controlled
active thermal solution helps customers meet acoustic targets in pedestal platforms
through the motherboards’s ability to directly control the RPM of the processor heat
sink fan. Please see
pulse width modulated (PWM) T-diode control. Use of a 4-pin PWM T-diode controlled
active thermal solution helps customers meet acoustic targets in pedestal platforms
through the motherboards’s ability to directly control the RPM of the processor heat
sink fan. Please see
for more details.
are
representations of the two heat sink solutions.
Figure 8-1. Boxed Dual-Core Intel Xeon Processor 5000 Series 1U Passive/2U Active
Combination Heat Sink (With Removable Fan)