Fujifilm Xeon 5050 S26361-F3248-L300 Scheda Tecnica
Codici prodotto
S26361-F3248-L300
Boxed Processor Specifications
90
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
Notes:
1.
The heat sinks represented in these images are for reference only, and may not represent the final boxed
processor heat sinks.
2.
The screws, springs, and standoffs will be captive to the heat sink. This image shows all of the components
in an exploded view.
3.
It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping.
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
Figure 8-2. Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink
Figure 8-3. 2U Passive Dual-Core Intel Xeon Processor 5000 Series Thermal Solution
(Exploded View)
Heat sink
Heat sink standoffs
Heat sink screw
springs
springs
Thermal Interface
Material
Material
Heat sink
screws
screws
Motherboard
and
processor
and
processor
Chassis pan
Protective Tape
CEK spring
Heat sink
Heat sink standoffs
Heat sink screw
springs
springs
Thermal Interface
Material
Material
Heat sink
screws
screws
Motherboard
and
processor
and
processor
Chassis pan
Protective Tape
CEK spring