Fujifilm Xeon 5060 S26361-F3318-L320 Scheda Tecnica
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S26361-F3318-L320
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
109
Boxed Processor Specifications
8.3.2.1
1U Passive/3U+ Active Combination Heat Sink Solution (1U Rack
Passive)
In the 1U configuration it is assumed that a chassis duct will be implemented to provide
a minimum airflow of 15 cfm at 0.38 in. H
a minimum airflow of 15 cfm at 0.38 in. H
2
O (25.5 m
3
/hr at 94.6 Pa) of flow
impedance. The duct should be carefully designed to minimize the airflow bypass
around the heatsink. It is assumed that a 40°C TLA is met. This requires a superior
chassis design to limit the TRISE at or below 5°C with an external ambient temperature
of 35°C. Following these guidelines will allow the designer to meet Dual-Core Intel
around the heatsink. It is assumed that a 40°C TLA is met. This requires a superior
chassis design to limit the TRISE at or below 5°C with an external ambient temperature
of 35°C. Following these guidelines will allow the designer to meet Dual-Core Intel
®
Xeon
®
Processor 5100 Series Thermal Profile and conform to the thermal requirements
of the processor.
8.3.2.2
1U Passive/3U+ Active Combination Heat Sink Solution (Pedestal
Active)
The active configuration of the combination solution is designed to help pedestal
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the TLA temperature of 40
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the TLA temperature of 40
°
C depending on the pedestal chassis layout.
Also, while the active thermal solution design will mechanically fit into a 2U volumetric,
it may not provide adequate airflow. This is due to the requirement of additional space
at the top of the thermal solution to allow sufficient airflow into the heat sink fan. Use
of the active configuration in a 2U rackmount chassis is not recommended.
it may not provide adequate airflow. This is due to the requirement of additional space
at the top of the thermal solution to allow sufficient airflow into the heat sink fan. Use
of the active configuration in a 2U rackmount chassis is not recommended.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
8.3.2.3
2U Passive Heat Sink Solution (2U+ Rack or Pedestal)
In the 2U+ passive configuration it is assumed that a chassis duct will be implemented
to provide a minimum airflow of 27 cfm at 0.182 in. H
to provide a minimum airflow of 27 cfm at 0.182 in. H
2
O (45.9 m
3
/hr at 45.3 Pa) of
flow impedance. The duct should be carefully designed to minimize the airflow bypass
around the heatsink. The T
around the heatsink. The T
LA
temperature of 40
°
C should be met. This may require the
use of superior design techniques to keep TRISE at or below 5°C based on an ambient
external temperature of 35°C.
external temperature of 35°C.
8.4
Boxed Processor Contents
A direct chassis attach method must be used to avoid problems related to shock and
vibration, due to the weight of the thermal solution required to cool the processor. The
board must not bend beyond specification in order to avoid damage. The boxed
processor contains the components necessary to solve both issues. The boxed
processor will include the following items:
vibration, due to the weight of the thermal solution required to cool the processor. The
board must not bend beyond specification in order to avoid damage. The boxed
processor contains the components necessary to solve both issues. The boxed
processor will include the following items:
• Dual-Core Intel
®
Xeon
®
Processor 5100 Series
• Unattached heat sink solution
• Four screws, four springs, and four heat sink standoffs (all captive to the heat sink)
• Foam air bypass pad and skirt (included with 1U passive/3U+ active solution)
• Thermal interface material (pre-applied on heat sink)
• Installation and warranty manual
• Intel Inside Logo
• Four screws, four springs, and four heat sink standoffs (all captive to the heat sink)
• Foam air bypass pad and skirt (included with 1U passive/3U+ active solution)
• Thermal interface material (pre-applied on heat sink)
• Installation and warranty manual
• Intel Inside Logo