Fujifilm Xeon 5060 S26361-F3318-L320 Scheda Tecnica
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S26361-F3318-L320
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
73
Thermal Specifications
6
Thermal Specifications
6.1
Package Thermal Specifications
The Dual-Core Intel® Xeon® Processor 5100 Series requires a thermal solution to
maintain temperatures within its operating limits. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
maintain temperatures within its operating limits. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Dual-
Core Intel
more information on designing a component level thermal solution, refer to the Dual-
Core Intel
®
Xeon
®
Processor 5100 Series Thermal/Mechanical Design Guidelines, and
Dual-Core Intel® Xeon® Processor LV 5138 in Embedded Applications Thermal/
Mechanical Design Guidelines.
Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to
for
details on the boxed processor. For the Dual-Core Intel® Xeon® Processor LV 5128,
follow the Dual-Core Intel® Xeon® Processor LV 5148 Thermal Profile.
6.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (T
systems, the processor must remain within the minimum and maximum case
temperature (T
CASE
) specifications as defined by the applicable thermal profile.
Thermal solutions not designed to provide this level of thermal capability may affect the
long-term reliability of the processor and system. For more details on thermal solution
design, please refer to the processor thermal/mechanical design guidelines.
long-term reliability of the processor and system. For more details on thermal solution
design, please refer to the processor thermal/mechanical design guidelines.
The Dual-Core Intel® Xeon® Processor LV 5148/5138/5128 implement a methodology
for managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
for managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
. The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see
indicated by PROCHOT# (see
, Processor Thermal Features). Systems that
implement fan speed control must be designed to use this data. Systems that do not
alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
The Dual-Core Intel® Xeon® Processor 5100 Series, Dual-Core Intel® Xeon®
Processor LV 5148, and Dual-Core Intel® Xeon® Processor LV 5128 support a single
Thermal Profile (see
Processor LV 5148, and Dual-Core Intel® Xeon® Processor LV 5128 support a single
Thermal Profile (see
,
,
). With these
Thermal Profiles, it's expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power-intensive
activated for very brief periods of time when running the most power-intensive