Bourns TBU-SING,BI-DIR/TBU-CA025-100-WH/DFN/BOU TBU-CA025-100-WH Scheda Tecnica

 Specifi cations are subject to change without notice.

Customers should verify actual device performance in their specifi c applications.

DIMENSIONS:

 MM

 (INCHES)

TBU

®

 High-Speed Protectors have a 100 % matte-tin termination 

fi nish. For improved thermal dissipation, the recommended layout 
uses PCB copper areas which extend beyond the exposed solder 
pad. The exposed solder pads should be defi ned by a solder mask 
which matches the pad layout of the TBU

®

 device in size and spac-

ing. It is recommended that they should be the same dimension as 
the TBU

®

 pads but if smaller solder pads are used, they should be 

centered on the TBU

®

 package terminal pads and not more than 

0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. 
Solder pad areas should not be larger than the TBU

®

 pad sizes 

to ensure adequate clearance is maintained. The recommended 
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil 
opening size 0.025 mm (0.0010 in.) less than the solder pad size. 
Extended copper areas beyond the solder pad signifi cantly improve 
the junction to ambient thermal resistance, resulting in operation 
at lower junction temperatures with a corresponding benefi t of reli-
ability. All pads should soldered to the PCB, including pads marked 
as NC or NU but no electrical connection should be made to these 
pads. For minimum parasitic capacitance, it is recommended that 
signal, ground or power signals are not routed beneath any pad.

PIN 1 & BACKSIDE CHAMFER

4.00 ± 0.10

(.157 ± .004)

0.00 - 0.05

(.000 - .002)

6.50 ± 0.10

(.256 ± .004)

0.85 ± 0.05

(.033 ± .002)

0.30

(.012)

3.40

(.134)

0.30

(.012)

1.85

(.073)

0.70

(.028)

0.70

(.028)

0.80

(.031)

1.85

(.073)

C

PIN 1

0.25

(.010)

3

2

1

1

Line In/Out

2

NU

3

Line Out/In