Fairchild Semiconductor N/A FMB3904 Scheda Tecnica

© 1998 Fairchild Semiconductor Corporation

  www.fairchildsemi.com

FFB3904 / FMB3904 / MMPQ3904 Rev. 1.1.1

2 

(1)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only. Values are at T

A

 = 25°C unless otherwise noted.

Note:
1. These ratings are based on a maximum junction temperature of 150

°C. These are steady-state limits. Fairchild

Semiconductor should be consulted on applications involving pulsed or low-duty cycle operations. 

(2)

Values are at T

A

 = 25°C unless otherwise noted.

Note:
2. PCB size: FR-4 76 x 114 x 0.6T mm

3

 (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size. 

FFB3904

.1A

SC70 6L

Tape and Reel

FMB3904

.1A

SSOT 6L

Tape and Reel

MMPQ3904

MMPQ3904

SOIC 16L

Tape and Reel

V

CEO

Collector-Emitter Voltage

40

V

V

CBO

Collector-Base Voltage

60

V

V

EBO

Emitter-Base Voltage

6.0

V

I

C

Collector Current - Continuous

200

mA

T

J

, T

STG

Operating and Storage Junction Temperature Range

-55 to +150

°C

P

D

Total Device Dissipation

300

700

1,000

mW

Derate above 25

°C

2.4

5.6

8.0

mW/

°C

R

θJA

Thermal Resistance, Junction to Ambient

415

180

°C/W

Thermal Resistance, Junction to Ambient,
Effective 4 Die

125

Thermal Resistance, Junction to Ambient,
Each Die

240