Intel E3-1105C AV8062701048800 Scheda Tecnica

Intel

®

 Xeon

®

 and Intel

®

 Core™ Processors For Communications Infrastructure

May 2012

Datasheet - Volume 1 of 2

Document Number: 327405

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001

61

The thermal solution provides both the component-level and the system-level thermal 

management. To allow for the optimal operation and long-term reliability of Intel 

processor-based systems, the system/processor thermal solution should be designed 

so that the processor:

• Remains below the maximum junction temperature (TJ-MAX) specification at the 

maximum Thermal Design Power (TDP).

• Conforms to system constraints, such as system acoustics, system skin-

temperatures, and exhaust-temperature requirements.

Thermal specifications given in this chapter are on the component and package level 

and apply specifically to the processor. Operating the processor outside the specified 

limits may result in permanent damage to the processor and potentially other 

components in the system.

The processor TDP is the maximum sustained power that should be used for design of 

the processor thermal solution. TDP represents an expected maximum sustained power 

from realistic applications. TDP may be exceeded for short periods of time or if running 

a “power virus” workload. 

The processor integrates multiple CPU on a single die. This may result in differences in 

the power distribution across the die and must be considered when designing the 

thermal solution. See the 2nd Generation Intel

Infrastructure Thermal/Mechanical Design Guide for more details.

The following notes apply to 

1

The TDPs given are not the maximum power the processor can generate.  Analysis indicates that 

real applications are unlikely to cause the processor to consume the theoretical maximum power 

dissipation for sustained periods of time.

2

The thermal solution needs to ensure that the processor temperature does not exceed the 

maximum junction temperature (Tj,max) limit, as measured by the DTS and the critical 

temperature bit.

3

The processor junction temperature is monitored by Digital Temperature Sensors (DTS). For DTS 

accuracy, see 

.

4

Digital Thermal Sensor (DTS) based fan speed control is required to achieve optimal thermal 

performance.  Intel recommends full cooling capability well before the DTS reading reaches 

Tj,Max. An example of this would be Tj,Max - 10ºC.

5

At  Tj  of  Tj,max