Intel i3-2328M FF8062701275100 Scheda Tecnica

Codici prodotto

FF8062701275100

Datasheet, Volume 1

Contents

Introduction ............................................................................................................ 11
1.1

Processor Feature Details ................................................................................... 13
1.1.1

Supported Technologies .......................................................................... 13

1.2

Interfaces ........................................................................................................ 13
1.2.1

System Memory Support ......................................................................... 13

1.2.2

PCI Express* ......................................................................................... 14

1.2.3

Direct Media Interface (DMI).................................................................... 15

1.2.4

Platform Environment Control Interface (PECI) ........................................... 16

1.2.5

Processor Graphics ................................................................................. 16

1.2.6

Embedded DisplayPort* (eDP).................................................................. 17

1.2.7

Intel

Flexible Display Interface (Intel

FDI) ............................................. 17

1.3

Power Management Support ............................................................................... 17
1.3.1

Processor Core....................................................................................... 17

1.3.2

System ................................................................................................. 17

1.3.3

Memory Controller.................................................................................. 17

1.3.4

PCI Express* ......................................................................................... 17

1.3.5

Direct Media Interface (DMI).................................................................... 17

1.3.6

Processor Graphics Controller................................................................... 18

1.4

Thermal Management Support ............................................................................ 18

1.5

Package ........................................................................................................... 18

1.6

Terminology ..................................................................................................... 18

1.7

Interfaces................................................................................................................ 21
2.1

System Memory Interface................................................................................... 21
2.1.1

System Memory Technology Supported ..................................................... 21

2.1.2

System Memory Timing Support............................................................... 22

2.1.3

System Memory Organization Modes......................................................... 22
2.1.3.1

Single-Channel Mode................................................................. 22

2.1.3.2

Dual-Channel Mode – Intel

Flex Memory Technology Mode ........... 22

2.1.4

Rules for Populating Memory Slots ............................................................ 23

2.1.5

Technology Enhancements of Intel

Fast Memory Access (Intel

FMA).......... 24

2.1.5.1

Just-in-Time Command Scheduling.............................................. 24

2.1.5.2

Command Overlap .................................................................... 24

2.1.5.3

Out-of-Order Scheduling ............................................................ 24

2.1.6

Memory Type Range Registers (MTRRs) Enhancement................................. 24

2.1.7

Data Scrambling .................................................................................... 24

2.1.8

DRAM Clock Generation........................................................................... 24

2.2

PCI Express* Interface....................................................................................... 25
2.2.1

PCI Express* Architecture ....................................................................... 25
2.2.1.1

Transaction Layer ..................................................................... 26

2.2.1.2

Data Link Layer ........................................................................ 26

2.2.1.3

Physical Layer .......................................................................... 26

2.2.2

PCI Express* Configuration Mechanism ..................................................... 27

2.2.3

PCI Express Graphics .............................................................................. 27

2.2.4

PCI Express* Lanes Connection ................................................................ 28

2.3

Direct Media Interface (DMI)............................................................................... 28
2.3.1

DMI Error Flow....................................................................................... 28

2.3.2

Processor / PCH Compatibility Assumptions................................................ 28

2.3.3

DMI Link Down ...................................................................................... 29

2.4

Processor Graphics Controller (GT) ...................................................................... 29