Intel i3-2328M FF8062701275100 Scheda Tecnica

Codici prodotto

FF8062701275100

Datasheet, Volume 1

4.2.4.4

Core C6 State........................................................................... 49

4.2.4.5

Core C7 State........................................................................... 49

4.2.4.6

C-State Auto-Demotion.............................................................. 50

4.2.5

Package C-States ................................................................................... 50
4.2.5.1

Package C0 .............................................................................. 51

4.2.5.2

Package C1/C1E ....................................................................... 52

4.2.5.3

Package C3 State...................................................................... 52

4.2.5.4

Package C6 State...................................................................... 52

4.2.5.5

Package C7 State...................................................................... 53

4.2.5.6

Dynamic L3 Cache Sizing ........................................................... 53

4.3

Integrated Memory Controller (IMC) Power Management ........................................ 53
4.3.1

Disabling Unused System Memory Outputs ................................................ 53

4.3.2

DRAM Power Management and Initialization ............................................... 54
4.3.2.1

Initialization Role of CKE ............................................................ 55

4.3.2.2

Conditional Self-Refresh............................................................. 55

4.3.2.3

Dynamic Power-down Operation ................................................. 56

4.3.2.4

DRAM I/O Power Management .................................................... 56

4.4

PCI Express* Power Management ........................................................................ 56

4.5

Direct Media Interface (DMI) Power Management .................................................. 56

4.6

Graphics Power Management .............................................................................. 57
4.6.1

Intel

Rapid Memory Power Management (Intel

RMPM)

(also known as CxSR) ............................................................................. 57

4.6.2

Intel

Graphics Performance Modulation Technology (Intel

GPMT) .............. 57

4.6.3

Graphics Render C-State ......................................................................... 57

4.6.4

Intel

Smart 2D Display Technology (Intel

S2DDT) .................................. 58

4.6.5

Intel

Graphics Dynamic Frequency.......................................................... 58

4.6.6

Display Power Savings Technology 6.0 (DPST) ........................................... 58

4.6.7

Automatic Display Brightness (ADB).......................................................... 59

4.6.8

Intel

Seamless Display Refresh Rate Switching Technology (Intel

SDRRS

Technology) .......................................................................................... 59

4.7

Thermal Power Management ............................................................................... 59

Thermal Management .............................................................................................. 61
5.1

Thermal Design Power (TDP) and Junction Temperature (Tj) ................................... 61

5.2

Thermal Considerations...................................................................................... 61
5.2.1

Intel

Turbo Boost Technology Power Control and Reporting........................ 62

5.2.2

Package Power Control............................................................................ 63

5.2.3

Power Plane Control................................................................................ 63

5.2.4

Turbo Time Parameter ............................................................................ 63

5.3

Thermal and Power Specifications........................................................................ 64

5.4

Thermal Management Features ........................................................................... 67
5.4.1

Processor Package Thermal Features......................................................... 67
5.4.1.1

Adaptive Thermal Monitor .......................................................... 68

5.4.1.2

Digital Thermal Sensor .............................................................. 70

5.4.1.3

PROCHOT# Signal..................................................................... 71

5.4.2

Processor Core Specific Thermal Features .................................................. 73
5.4.2.1

On-Demand Mode ..................................................................... 73

5.4.3

Memory Controller Specific Thermal Features ............................................. 73
5.4.3.1

Programmable Trip Points .......................................................... 73

5.4.4

Platform Environment Control Interface (PECI) ........................................... 74
5.4.4.1

Fan Speed Control with Digital Thermal Sensor ............................. 74

Signal Description ................................................................................................... 75
6.1

System Memory Interface Signals........................................................................ 76

6.2

Memory Reference and Compensation Signals ....................................................... 77

6.3

Reset and Miscellaneous Signals.......................................................................... 78

6.4

PCI Express*-Based Interface Signals .................................................................. 79