Scheda Tecnica (80552PG0802M2M)SommarioContents3Figures5Tables6Revision History7Intel® Pentium® 4 Processor 6x1 Sequence8Intel® Pentium® 4 Processor 6x1D Sequence11 Introduction91.1 Terminology101.1.1 Processor Packaging Terminology101.2 References112 Electrical Specifications132.1 Power and Ground Lands132.2 Decoupling Guidelines132.2.1 VCC Decoupling132.2.2 VTT Decoupling132.2.3 FSB Decoupling142.3 Voltage Identification142.4 Reserved, Unused, and TESTHI Signals162.5 Voltage and Current Specification172.5.1 Absolute Maximum and Minimum Ratings172.5.2 DC Voltage and Current Specification182.5.3 VCC Overshoot212.5.4 Die Voltage Validation222.6 Signaling Specifications222.6.1 FSB Signal Groups232.6.2 GTL+ Asynchronous Signals252.6.3 Processor DC Specifications252.7 Clock Specifications292.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking292.7.2 FSB Frequency Select Signals (BSEL[2:0])302.7.3 Phase Lock Loop (PLL) and Filter302.7.4 BCLK[1:0] Specifications323 Package Mechanical Specifications333.1 Package Mechanical Drawing333.2 Processor Component Keep-Out Zones373.3 Package Loading Specifications373.4 Package Handling Guidelines373.5 Package Insertion Specifications383.6 Processor Mass Specification383.7 Processor Materials383.8 Processor Markings383.9 Processor Land Coordinates394 Land Listing and Signal Descriptions414.1 Processor Land Assignments414.2 Alphabetical Signals Reference645 Thermal Specifications and Design Considerations755.1 Processor Thermal Specifications755.1.1 Thermal Specifications755.1.2 Thermal Metrology795.2 Processor Thermal Features795.2.1 Thermal Monitor795.2.2 Thermal Monitor 2805.2.3 On-Demand Mode815.2.4 PROCHOT# Signal825.2.5 THERMTRIP# Signal825.2.6 TCONTROL and Fan Speed Reduction825.2.7 Thermal Diode826 Features856.1 Power-On Configuration Options856.2 Clock Control and Low Power States856.2.1 Normal State866.2.2 HALT and Enhanced HALT Powerdown States866.2.3 Stop Grant State876.2.4 Enhanced HALT Snoop or HALT Snoop State, Stop Grant Snoop State887 Boxed Processor Specifications897.1 Mechanical Specifications897.1.1 Boxed Processor Cooling Solution Dimensions897.1.2 Boxed Processor Fan Heatsink Weight917.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly917.2 Electrical Requirements917.2.1 Fan Heatsink Power Supply917.3 Thermal Specifications937.3.1 Boxed Processor Cooling Requirements938 Balanced Technology Extended (BTX) Boxed Processor Specifications958.1 Mechanical Specifications968.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions968.1.2 Boxed Processor Thermal Module Assembly Weight988.1.3 Boxed Processor Support and Retention Module (SRM)988.2 Electrical Requirements998.2.1 Thermal Module Assembly Power Supply998.3 Thermal Specifications1018.3.1 Boxed Processor Cooling Requirements1018.3.2 Variable Speed Fan1029 Debug Tools Specifications1059.1 Logic Analyzer Interface (LAI)1059.1.1 Mechanical Considerations1059.1.2 Electrical Considerations105Dimensioni: 4,09 MBPagine: 106Language: EnglishApri il manuale