Manuale Utente (AT80601002274AA)SommarioContents3Figures4Tables5Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features7Revision History8Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series11 Introduction91.1 Terminology101.2 References112 Electrical Specifications132.1 Intel® QPI Differential Signaling132.2 Power and Ground Lands132.3 Decoupling Guidelines132.3.1 VCC, VTTA, VTTD, VDDQ Decoupling142.4 Processor Clocking (BCLK_DP, BCLK_DN)142.4.1 PLL Power Supply142.5 Voltage Identification (VID)142.6 Reserved or Unused Signals172.7 Signal Groups182.8 Test Access Port (TAP) Connection192.9 Platform Environmental Control Interface (PECI) DC Specifications202.9.1 DC Characteristics202.9.2 Input Device Hysteresis212.10 Absolute Maximum and Minimum Ratings212.11 Processor DC Specifications222.11.1 DC Voltage and Current Specification232.11.2 VCC Overshoot Specification292.11.3 Die Voltage Validation303 Package Mechanical Specifications313.1 Package Mechanical Drawing313.2 Processor Component Keep-Out Zones343.3 Package Loading Specifications343.4 Package Handling Guidelines343.5 Package Insertion Specifications343.6 Processor Mass Specification353.7 Processor Materials353.8 Processor Markings353.9 Processor Land Coordinates364 Land Listing375 Signal Descriptions676 Thermal Specifications716.1 Package Thermal Specifications716.1.1 Thermal Specifications716.1.2 Thermal Metrology756.2 Processor Thermal Features766.2.1 Processor Temperature766.2.2 Adaptive Thermal Monitor766.2.3 THERMTRIP# Signal796.3 Platform Environment Control Interface (PECI)796.3.1 Introduction796.3.2 PECI Specifications816.4 Storage Conditions Specifications827 Features837.1 Power-On Configuration (POC)837.2 Clock Control and Low Power States837.2.1 Thread and Core Power State Descriptions847.2.2 Package Power State Descriptions857.3 Sleep States867.4 ACPI P-States (Intel® Turbo Boost Technology)867.5 Enhanced Intel® SpeedStep® Technology878 Boxed Processor Specifications898.1 Introduction898.2 Mechanical Specifications908.2.1 Boxed Processor Cooling Solution Dimensions908.2.2 Boxed Processor Fan Heatsink Weight928.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly928.3 Electrical Requirements928.3.1 Fan Heatsink Power Supply928.4 Thermal Specifications938.4.1 Boxed Processor Cooling Requirements938.4.2 Variable Speed Fan95Dimensioni: 685 KBPagine: 96Language: EnglishApri il manuale