用户手册 — Intel i7-975

目录

• Contents

  3
• Figures

  4
• Tables

  5
• Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features

  7
• Revision History

  8
• Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series

  1
• 1 Introduction

  9
  • 1.1 Terminology

    10
  • 1.2 References

    11
• 2 Electrical Specifications

  13
  • 2.1 Intel® QPI Differential Signaling

    13
  • 2.2 Power and Ground Lands

    13
  • 2.3 Decoupling Guidelines

    13
    • 2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling

      14
  • 2.4 Processor Clocking (BCLK_DP, BCLK_DN)

    14
    • 2.4.1 PLL Power Supply

      14
  • 2.5 Voltage Identification (VID)

    14
  • 2.6 Reserved or Unused Signals

    17
  • 2.7 Signal Groups

    18
  • 2.8 Test Access Port (TAP) Connection

    19
  • 2.9 Platform Environmental Control Interface (PECI) DC Specifications

    20
    • 2.9.1 DC Characteristics

      20
    • 2.9.2 Input Device Hysteresis

      21
  • 2.10 Absolute Maximum and Minimum Ratings

    21
  • 2.11 Processor DC Specifications

    22
    • 2.11.1 DC Voltage and Current Specification

      23
    • 2.11.2 VCC Overshoot Specification

      29
    • 2.11.3 Die Voltage Validation

      30
• 3 Package Mechanical Specifications

  31
  • 3.1 Package Mechanical Drawing

    31
  • 3.2 Processor Component Keep-Out Zones

    34
  • 3.3 Package Loading Specifications

    34
  • 3.4 Package Handling Guidelines

    34
  • 3.5 Package Insertion Specifications

    34
  • 3.6 Processor Mass Specification

    35
  • 3.7 Processor Materials

    35
  • 3.8 Processor Markings

    35
  • 3.9 Processor Land Coordinates

    36
• 4 Land Listing

  37
• 5 Signal Descriptions

  67
• 6 Thermal Specifications

  71
  • 6.1 Package Thermal Specifications

    71
    • 6.1.1 Thermal Specifications

      71
    • 6.1.2 Thermal Metrology

      75
  • 6.2 Processor Thermal Features

    76
    • 6.2.1 Processor Temperature

      76
    • 6.2.2 Adaptive Thermal Monitor

      76
    • 6.2.3 THERMTRIP# Signal

      79
  • 6.3 Platform Environment Control Interface (PECI)

    79
    • 6.3.1 Introduction

      79
    • 6.3.2 PECI Specifications

      81
  • 6.4 Storage Conditions Specifications

    82
• 7 Features

  83
  • 7.1 Power-On Configuration (POC)

    83
  • 7.2 Clock Control and Low Power States

    83
    • 7.2.1 Thread and Core Power State Descriptions

      84
    • 7.2.2 Package Power State Descriptions

      85
  • 7.3 Sleep States

    86
  • 7.4 ACPI P-States (Intel® Turbo Boost Technology)

    86
  • 7.5 Enhanced Intel® SpeedStep® Technology

    87
• 8 Boxed Processor Specifications

  89
  • 8.1 Introduction

    89
  • 8.2 Mechanical Specifications

    90
    • 8.2.1 Boxed Processor Cooling Solution Dimensions

      90
    • 8.2.2 Boxed Processor Fan Heatsink Weight

      92
    • 8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      92
  • 8.3 Electrical Requirements

    92
    • 8.3.1 Fan Heatsink Power Supply

      92
  • 8.4 Thermal Specifications

    93
    • 8.4.1 Boxed Processor Cooling Requirements

      93
    • 8.4.2 Variable Speed Fan

      95