HP (Hewlett-Packard) HP BladeSystem Enclosure technologies ユーザーズマニュアル

 

Abstract 

The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack-

mounted infrastructure. The c3000 Enclosure is designed for remote sites, small and medium-sized 

businesses, and data centers with special power and cooling constraints. This technology brief 

provides an overview of the HP BladeSystem c3000 Enclosure, including a comparison with the 
enterprise-class HP BladeSystem c7000 Enclosure, Thermal Logic power and cooling technologies, 

and interconnect options.  
This technology brief assumes the reader is familiar with HP ProLiant server technology and has some 

knowledge of general BladeSystem architecture. For more information about the infrastructure 
components, see the HP website at 

Overview of HP BladeSystem c3000 Enclosure 

The HP BladeSystem c3000 Enclosure, announced in September 2007, is the newest enclosure 

implemented using the BladeSystem c-Class architecture. While the c7000 Enclosure is optimized for 

enterprise data center applications, the c3000 Enclosure is optimized for other computing 

environments, such as remote sites or small businesses. More information on c-Class architecture and 
the c7000 Enclosure is available on the HP technology website at 

.  

The c3000 Enclosure fits into standard size HP and third-party racks, and accommodates c-Class 

form-factor server/storage blades and interconnect modules. It has the flexibility to scale from a single 

enclosure holding up to 8 server blades, to a rack containing 7 enclosures holding up to 56 

server/storage blades total. It is optimized for data centers with special power and cooling 
constraints, such as DC powered racks, or data centers with low power and cooling capacities (under 

4000 watts per rack). The c3000 Enclosure is designed for use with management devices such as 

local KVM switches for local administration.  
The HP BladeSystem c3000 Enclosure has a fully redundant design with redundant signal paths 
between servers and interconnect modules. The enclosure is available with a single-phase power 

subsystem. It can be populated with the following components: 
• 

Up to 4 full-height (FH) server blades or up to 8 half-height (HH) server and/or storage blades per 

enclosure 

• 

Up to 4 interconnect modules simultaneously supporting a variety of network interconnect fabrics 

such as Ethernet, Fibre Channel (FC), InfiniBand (IB), Internet Small Computer System Interface 

(iSCSI), or Serial-attached SCSI (SAS)  

• 

Active Cool fan kits for a maximum of 6 fans 

• 

Up to 6 power supplies, accepting either low-line (100 to 120 volts alternating current [VAC]), or 

high-line (200 to 240 VAC) power input 

• 

Onboard Administrator (OA) management module  

• 

Optional DVD drive 

• 

Optional KVM enclosure module for connecting the c3000 to a in-rack KVM switch 

Both c-Class enclosures have common critical components such as servers, interconnects, mezzanine 

cards, storage blades, power supplies, and fans. Table 1 lists components supported by the c3000 

and c7000 Enclosures. 

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