HP (Hewlett-Packard) HP BladeSystem Enclosure technologies ユーザーズマニュアル
Figure 2.
HP BladeSystem c3000 Enclosure – rear view
HP Thermal Logic technologies
with a variety of HP Thermal Logic
onnect
er
view
:
t Scalable Enclosure Cooling (PARSEC) design
undancy modes
alancing
HP BladeSystem c-Class products have been designed
technologies―a set of technologies integrated across server blades, enclosures, and interc
modules―all of which combined provide significant power and cooling benefits in comparison to
traditional rack and tower based servers. HP BladeSystem products reduce overall demand for pow
traditional rack and tower based servers. HP BladeSystem products reduce overall demand for pow
and cooling by as much as 40 percent compared to standard rack and tower based servers. Thermal
Logic is the term that HP uses to define the mechanical design features, built-in intelligence, and
control capabilities throughout the BladeSystem c-Class. Thermal Logic technologies enable IT
administrators to make the most of the power and thermal environments. They provide an instant
administrators to make the most of the power and thermal environments. They provide an instant
of power usage and temperature at the server, enclosure, or rack level. Thermal Logic technologies
automatically adjust power and thermal controls to minimize power and cooling usage while
maintaining adequate cooling for all devices and ensuring high availability.
HP Thermal Logic technologies include the following elements and capabilities
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HP Thermal Logic technologies include the following elements and capabilities
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Active Cool fans
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Parallel Redundan
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Instant power and thermal monitoring
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Pooled power for a variety of power red
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Dynamic Power Saver mode
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Power Regulator
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Power workload b
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