Jameco Electronics 3000 ユーザーズマニュアル

Figure 5-3 shows the PC board land pattern for the Rabbit 3000 chip in a 128-pin LQFP 
package. This land pattern is based on the IPC-SM-782 standard developed by the Surface 
Mount Land Patterns Committee and specified in Surface Mount Design and Land Pat-
tern Standard, IPC, Northbrook, IL, 1999.

13.75 mm (min.)

16.85 mm (max.)

12.4 mm

15.3 mm

0.28 mm (max.)

0.40 mm

13.75 mm (min.)

16.85 mm (max.)

12.4 mm

15.3 mm

1.55 mm

J

T

: 0.29–0.55 mm

J

H

: 0.29–0.604 mm

J

S

: -0.01–0.077 mm

Z

max

: 16.85 mm

G

min

: 13.75 mm

W

min

S

max

L

min

T

Solder fillet min/max (toe, heel, and side respectively)

Toe-to-toe distance across chip

Heel-to-heel distance across chip

Toe-to-heel distance on pin

Width of pin

J:

L:

S:

T:

W:

(max.)