Philips BUK209-50Y ユーザーズマニュアル
Philips Semiconductors
Product specification
TOPFET high side switch
BUK214-50Y
SMD version of BUK209-50Y
MECHANICAL DATA
Fig.4. SOT426 surface mounting package
1
, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT426
0
2.5
5 mm
scale
Plastic single-ended surface mounted package (Philips version of D
2
-PAK); 5 leads
(one lead cropped)
SOT426
e
e
e
e
E
b
A1
A
A1
Lp
b
c
D
max.
e
A
UNIT
DIMENSIONS (mm are the original dimensions)
E
11
mm
4.50
4.10
4.10
1.40
1.27
1.27
0.85
0.60
0.60
0.64
0.46
0.46
2.90
2.10
2.10
HD
15.80
14.80
14.80
Q
2.60
2.20
2.20
10.30
9.70
D1
1.60
1.20
1.20
1.70
98-12-14
99-06-25
99-06-25
1
3
2
4
5
mounting
base
D1
HD
D
Q
Lp
c
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
September 2002
7
Rev 2.000