Intel 945GZ ユーザーズマニュアル

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Reference Thermal Solution 
 
 
Thermal and Mechanical Design Guidelines   
 21 
Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a 
Balanced Technology Extended (BTX) Platform 
Top View
Balanced Technology
Extended (BTX)  Thermal
Module Assembly Over
Processor
(G)MCH
Airflow Direction
Proc_HS_Orient
 
4.2 
Mechanical Design Envelope 
The motherboard component keep-out restrictions for the (G)MCH on an ATX platform 
are included in 
Appendix B, Figure 10. The motherboard component keep-out 
restrictions for the (G)MCH on a BTX platform are included in Figure 11. 
System integrators should ensure no board or chassis components would intrude into 
the volume occupied by the (G)MCH thermal solution. 
4.3 
Thermal Solution Assembly 
The reference thermal solution for the (G)MCH for an ATX platform is shown in  
Figure 7 and 
Appendix B and is an aluminum extruded heatsink that uses two ramp 
retainers, a wire preload clip, and four custom motherboard anchors. The heatsink is 
attached to the motherboard by assembling the anchors into the board, placing the 
heatsink over the (G)MCH and anchors at each of the corners, and securing the plastic 
ramp retainers through the anchor loops before snapping each retainer into the fin 
gap. The assembly is then sent through the wave process. Post wave, the wire preload 
clip is assembled using the hooks on each of the ramp retainers. The clip provides the 
mechanical preload to the package. A thermal interface material (Chomerics* T710) is 
pre-applied to the heatsink bottom over an area that contacts the package die. 
The reference thermal solution for the (G)MCH for a BTX platform is shown in  
Figure 8. The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is 
secured to the system motherboard via two solder-down anchors around the (G)MCH. 
The clip helps to provide a mechanical preload to the package via the heatsink. A 
thermal interface material (Chomerics* T710) is pre-applied to the heatsink bottom 
over an area in contact with the package die. 
The ATX reference thermal solution differs from the BTX reference solution because a 
BTX platform requires a Support and Retention Mechanism (SRM) that helps to meet 
the mechanical requirements listed in Table 4.