Multi-Tech Systems 92U10E06831 ユーザーズマニュアル
Part 1
− Universal Socket Connectivity
Chapter 1 – Universal Socket Connectivity
Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342M)
16
Design Considerations
Noise Suppression Design Considerations
Engineering noise-suppression practices must be adhered to when designing a printed circuit board (PCB)
containing the SocketModem. Suppression of noise is essential to the proper operation and performance of the
modem itself and for surrounding equipment.
Two aspects of noise in an OEM board design containing the SocketModem must be considered: on-board/off-
board generated noise that can affect digital signal processing. Both on-board and off-board generated noise
that is coupled on-board can affect interface signal levels and quality. Of particular concern is noise in frequency
ranges affecting modem performance.
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is a
separate, but equally important, concern. This type of noise can affect the operation of surrounding equipment.
Most local government agencies have stringent certification requirements that must be met for use in specific
environments.
Proper PC board layout (component placement, signal routing, trace thickness and geometry, etc.) component
selection (composition, value, and tolerance), interface connections, and shielding are required for the board
design to achieve desired modem performance and to attain EMI certification.
Other aspects of proper noise-suppression engineering practices are beyond the scope of this designer guide.
The designer should consult noise suppression techniques described in technical publications and journals,
electronics and electrical engineering text books, and component supplier application notes.
containing the SocketModem. Suppression of noise is essential to the proper operation and performance of the
modem itself and for surrounding equipment.
Two aspects of noise in an OEM board design containing the SocketModem must be considered: on-board/off-
board generated noise that can affect digital signal processing. Both on-board and off-board generated noise
that is coupled on-board can affect interface signal levels and quality. Of particular concern is noise in frequency
ranges affecting modem performance.
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is a
separate, but equally important, concern. This type of noise can affect the operation of surrounding equipment.
Most local government agencies have stringent certification requirements that must be met for use in specific
environments.
Proper PC board layout (component placement, signal routing, trace thickness and geometry, etc.) component
selection (composition, value, and tolerance), interface connections, and shielding are required for the board
design to achieve desired modem performance and to attain EMI certification.
Other aspects of proper noise-suppression engineering practices are beyond the scope of this designer guide.
The designer should consult noise suppression techniques described in technical publications and journals,
electronics and electrical engineering text books, and component supplier application notes.
PC Board Layout Guidelines
In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and
ground are typically on the inner layers. All power and ground traces should be 0.05 inches wide.
The recommended hole size for the SocketModem pins is 0.036 in. +/-0.003 in. in diameter. Spacers can be
used to hold the SocketModem vertically in place during the wave solder process.
All creepages and clearances for the SocketModem have been designed to meet requirements of safety
standards EN60950 or EN60601. The requirements are based on a working voltage of 125V or 250V. When the
recommended DAA* circuit interface is implemented in a third party design, all creepage and clearance
requirements must be strictly followed in order to meet safety standards. The third party safety design must be
evaluated by the appropriate national agency per the required specification.
User accessible areas: Based on where the third party design is to be marketed, sold, or used, it may be
necessary to provide an insulating cover over all TNV exposed areas. Consult with the recognized safety
agency to determine the requirements.
ground are typically on the inner layers. All power and ground traces should be 0.05 inches wide.
The recommended hole size for the SocketModem pins is 0.036 in. +/-0.003 in. in diameter. Spacers can be
used to hold the SocketModem vertically in place during the wave solder process.
All creepages and clearances for the SocketModem have been designed to meet requirements of safety
standards EN60950 or EN60601. The requirements are based on a working voltage of 125V or 250V. When the
recommended DAA* circuit interface is implemented in a third party design, all creepage and clearance
requirements must be strictly followed in order to meet safety standards. The third party safety design must be
evaluated by the appropriate national agency per the required specification.
User accessible areas: Based on where the third party design is to be marketed, sold, or used, it may be
necessary to provide an insulating cover over all TNV exposed areas. Consult with the recognized safety
agency to determine the requirements.
Note:
Even if the recommended design considerations are followed, there are no guarantees that a particular
system will comply with all the necessary regulatory requirements. It is imperative that specific designs be
completely evaluated by a qualified/recognized agency.
*DAA stands for Data Access Arrangement. DAA is the telephone line interface of the SocketModem.
completely evaluated by a qualified/recognized agency.
*DAA stands for Data Access Arrangement. DAA is the telephone line interface of the SocketModem.
Important
MTSMC Tooling Holes and Mounting Hardware
MTSMC Tooling Holes and Mounting Hardware
It is recommended that nylon hardware be used if the SocketModems are to be mounted using the two tooling
holes due to possible traces and vias around the tooling holes. #4 or M2/M3 hardware should be used for
mounting. This applies to the following cellular SocketModems:
holes due to possible traces and vias around the tooling holes. #4 or M2/M3 hardware should be used for
mounting. This applies to the following cellular SocketModems:
SocketModem
Cell & SocketModem
iCell GPRS (MTSMC-G2)
SocketModem® Cell and SocketModem iCell CDMA 1xRTT (MTSMC-C1)
SocketModem® HSDPA (MTSMC-H)
SocketModem® HSDPA (MTSMC-H)
Note:
See the Mechanical Drawings for these SocketModems.
Preliminary
Confidential