Volansys Technologies pvt ltd MKW41Z ユーザーズマニュアル
VT-MKW41Z Module Datasheet
Rev 0.4
Confidential
Copyright © 2017 Volansys
Volansys Technologies
Page | 27
10 R
ECOMMENDED
R
EFLOW
P
ROFILE
Recommended Reflow Profile
Parameters Values
Ramp Up Rate (from T soak max to T peak)
3°/sec max
Minimum Soak Temperature
150°C
Maximum Soak Temperature
200°C
Soak Time
90 30 sec
T Liquids
220°C
Time above TL
60-150 sec
T peak
250°C
Time within 5º of T peak
20-30 sec
Time from 25° to T peak
8 min max
Ramp Down Rate
6°C/sec max
Figure 5: Reflow Soldering Profile
Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process. Cleaning
the module is strongly discouraged because it will be difficult to ensure no cleaning agent and other
residuals are remaining underneath the shielding can as well as in the gap between the module and the
host board.
Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited: Do not place the module on the bottom / underside of your PCB and
re-flow
the module is strongly discouraged because it will be difficult to ensure no cleaning agent and other
residuals are remaining underneath the shielding can as well as in the gap between the module and the
host board.
Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited: Do not place the module on the bottom / underside of your PCB and
re-flow