Microchip Technology MA240029 データシート
PIC24FJ128GA310 FAMILY
DS39996F-page 360
2010-2011 Microchip Technology Inc.
32.1
DC Characteristics
FIGURE 32-1:
PIC24FJ128GA310 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 32-1:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
PIC24FJ128GA310 family:
Operating Junction Temperature Range
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Power Dissipation:
Internal Chip Power Dissipation: P
Internal Chip Power Dissipation: P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
P
I
/
O
=
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
JMAX
– T
A
)/
JA
W
Frequency
V
o
lt
ag
e (V
DD
)
2.0V
32 MHz
3.6V
3.6V
2.0V
2.2V
2.2V
Note:
V
CAP
(nominal On-Chip Regulator output voltage) = 1.8V.
PIC24FJXXXDA1
TABLE 32-2:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Note
Package Thermal Resistance, 14x14x1 mm 100-pin TQFP
JA
43.0
—
°C/W
(Note
Package Thermal Resistance, 12x12x1 mm 100-pin TQFP
JA
45.0
—
°C/W
(Note
Package Thermal Resistance, 12x12x1 mm 80-pin TQFP
JA
48.0
—
°C/W
(Note
Package Thermal Resistance, 10x10x1 mm 64-pin TQFP
JA
48.3
—
°C/W
(Note
Package Thermal Resistance, 9x9x0.9 mm 64-pin QFN
JA
28.0
—
°C/W
(Note
Package Thermal Resistance, 10x10x1.1 mm 121-pin BGA
JA
40.2
—
°C/W
(Note
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.