Microchip Technology MA240029 データシート

 2010-2011 Microchip Technology Inc.

DS39996F-page 403

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

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Architecture

24

= 16-bit modified Harvard without DSP

Flash Memory Family

FJ

= Flash program memory

Product Group

GA3 = General-purpose microcontrollers with 

LCD Controller and nanoWatt XLP Technology

Pin Count

06

= 64-pin

08

= 80-pin

10

= 100-pin (TQFP) and 121-pin (BGA)

Temperature Range

I

=  -40

C to +85C (Industrial)

Package

BG = 121-pin (10x10x1.4 mm) BGA package 

PT = 100-lead (12x12x1 mm) TQFP (Thin Quad Flatpack)

PF = 100-lead (14x14x1 mm) TQFP (Thin Quad Flatpack)

PT  = 80-pin (12x12x1 mm) TQFP (Thin Quad Flatpack)

PT =  64-lead (10x10x1 mm) TQFP (Thin Quad Flatpack)

MR = 64-lead (9x9x0.9 mm) QFN (Quad Flatpack, No Lead)

Pattern

Three-digit QTP, SQTP, Code or Special Requirements 

(blank otherwise)
ES = Engineering Sample

a)

PIC24FJ64GA306-I/MR:
PIC24F device with LCD Controller and nano-
Watt XLP Technology, 64 KB program memory,
64-pin, Industrial temp., QFN package.

b)

PIC24FJ128GA308-I/PT:
PIC24F device with LCD Controller and nano-
Watt XLP Technology, 128 KB program
memory, 80-pin, Industrial temp., TQFP
package.

c)

PIC24FJ128GA210-I/BG:
PIC24F device with LCD Controller and nano-
Watt XLP Technology, 128 KB program
memory, 121-pin, Industrial temp., BGA
package.