Microchip Technology TSSOP20EV データシート
Installation and Operation
© 2009 Microchip Technology Inc.
DS51875A-page 17
TABLE 2-1:
OPTIONAL COMPONENTS
(2)
Component
Comment
C1, C2
Power supply bypass capacitors
C3, C4
PIC Crystal capacitors
R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U,
R9U, R10U, R11U, R12U, R13U, R14U, R15U,
R16U, R17U, R18U, R19U, R20U
R9U, R10U, R11U, R12U, R13U, R14U, R15U,
R16U, R17U, R18U, R19U, R20U
Pull-up resistors
R1D, R2D, R3D, R4D, R5D, R6D, R7D, R8D,
R9D, R10D, R11D, R12D, R13D, R14D, R15D,
R16D, R17D, R18D, R19D, R20D
R9D, R10D, R11D, R12D, R13D, R14D, R15D,
R16D, R17D, R18D, R19D, R20D
Pull-down resistors
Y1
Can connect to either PIC’ main oscillator
or to the Timer oscillator circuit.
or to the Timer oscillator circuit.
J1
PICkit Serial / ICSP header
Note 1:
Whichever pin is the device’s VDD pin, that corresponding RxD footprint can be
used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then
install the bypass capacitor in the R8D footprint.
used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then
install the bypass capacitor in the R8D footprint.
2:
All passive components use the surface mount 805 footprint.