Microchip Technology TSSOP20EV データシート

© 2009 Microchip Technology Inc.

DS51875A-page 19

This section describes the characteristics of the component footprints so that you are 
better able to determine if the desired component(s) are compatible with the board.

2.4.4.1

TSSOP-20

The 20-pin TSSOP footprint has been layed out for packages that have a typical pitch 
of 0.65 mm (BSC), a maximum lead width of 0.30 mm, and a molded package width of 
4.50 mm (BSC). Twenty-lead (or less, such as sixteen-lead and fourteen-lead) TSSOP 
packages that meet these characteristics should be able to be used with this board.

2.4.4.2

SSOP-20

The 20-pin SSOP footprint has been layed out for packages that have a typical pitch of 
0.65 mm (BSC), a maximum lead width of 0.38 mm, and a maximum molded package 
width of 5.60 mm. Twenty-lead (or less) SSOP packages that meet these 
characteristics should be able to be used with this board.

2.4.4.3

DIP-20

The 20-pin DIP footprint has been layed out for packages that have a typical pitch of 
100 mil (BSC), a maximum lead width of 22 mil and a molded package width of 600 mil.

2.4.4.4

PASSIVE COMPONENTS

All passive components (RxU, RxD, and Cx) use a surface mount 805 footprint. Any 
component that has a compatible footprint could be used with this board.

2.4.4.5

HEADER (1X6)

The header has a typical pitch of 100 mil (BSC). This header is designed to be 
compatible with the PICkit Serial Analyzer and PICkit 2 Programmer.