Analog Devices AD5560 Evaluation Board EVAL-AD5560EBUZ EVAL-AD5560EBUZ データシート
製品コード
EVAL-AD5560EBUZ
AD5560
Data Sheet
Rev. D | Page 64 of 68
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-ACD-HU
1
0-
19-
201
1-
C
49
64
17
1
16
32
33
48
0.50
BSC
LEAD PITCH
12.20
12.00 SQ
11.80
12.00 SQ
11.80
10.20
10.00 SQ
9.80
10.00 SQ
9.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
7°
3.5°
0°
0.15
0.05
0.05
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
1.05
1.00
0.95
1.00
0.95
0.20
0.09
0.09
VIEW A
1.20
MAX
SEATING
PLANE
0.75
0.60
0.45
0.60
0.45
1.00 REF
0.27
0.22
0.17
0.22
0.17
BOTTOM VIEW
(PINS UP)
49
64
1
17
16
32
33
48
0.675
0.872
7.85
BSC
7.85
BSC
5.95
BSC
5.95 BSC
TOP VIEW
(PINS DOWN)
EXPOSED
PAD
Figure 63. 64-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-64-3)
Dimensions shown in millimeters
*COMPLIANT TO JEDEC STANDARDS MO-225 WITH
EXCEPTION TO PACKAGE HEIGHT.
A
B
C
D
E
F
G
1
3
2
4
5
6
7
8
9
BOTTOM VIEW
H
J
DETAIL A
TOP VIEW
DETAIL A
6.865 REF
5.720 REF
0.40 REF
(DIE OFFSET)
04
-19-
2
01
2-
B
8.10
8.00 SQ
7.90
8.00 SQ
7.90
*1.20
1.08
1.00
1.00
0.36
REF
SEATING
PLANE
0.39
0.34
0.29
0.34
0.29
0.81
0.76
0.71
0.76
0.71
0.50
0.45
0.40
0.45
0.40
BALL DIAMETER
COPLANARITY
0.12
0.12
6.40
BSC SQ
0.80
BSC
0.80
REF
A1 BALL
CORNER
CORNER
A1 BALL
CORNER
Figure 64. 72-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-72-2)
Dimensions shown in millimeters