Intel 1020E AV8063801276200 ユーザーズマニュアル
製品コード
AV8063801276200
Interfaces
28
Datasheet, Volume 1
2.2
PCI Express* Interface
This section describes the PCI Express interface capabilities of the processor. See the
PCI Express Base Specification for details of PCI Express.
PCI Express Base Specification for details of PCI Express.
The number of PCI Express controllers is dependent on the platform. Refer to
for details.
2.2.1
PCI Express* Architecture
Compatibility with the PCI addressing model is maintained to ensure that all existing
applications and drivers may operate unchanged.
applications and drivers may operate unchanged.
The PCI Express configuration uses standard mechanisms as defined in the PCI
Plug-and-Play specification. The processor external graphics ports support Gen 3 speed
as well. At 8 GT/s, Gen 3 operation results in twice as much bandwidth per lane as
compared to Gen 2 operation. The 16-lane PCI Express* graphics port can operate at
either 2.5 GT/s, 5 GT/s, or 8 GT/s.
Plug-and-Play specification. The processor external graphics ports support Gen 3 speed
as well. At 8 GT/s, Gen 3 operation results in twice as much bandwidth per lane as
compared to Gen 2 operation. The 16-lane PCI Express* graphics port can operate at
either 2.5 GT/s, 5 GT/s, or 8 GT/s.
PCI Express* Gen 3 uses a 128/130b encoding scheme, eliminating nearly all of the
overhead of the 8b/10b encoding scheme used in Gen 1 and Gen 2 operation.
overhead of the 8b/10b encoding scheme used in Gen 1 and Gen 2 operation.
The PCI Express architecture is specified in three layers – Transaction Layer, Data Link
Layer, and Physical Layer. The partitioning in the component is not necessarily along
these same boundaries. Refer to
Layer, and Physical Layer. The partitioning in the component is not necessarily along
these same boundaries. Refer to
for the PCI Express layering diagram.
PCI Express uses packets to communicate information between components. Packets
are formed in the Transaction and Data Link Layers to carry the information from the
transmitting component to the receiving component. As the transmitted packets flow
through the other layers, they are extended with additional information necessary to
handle packets at those layers. At the receiving side, the reverse process occurs and
packets get transformed from their Physical Layer representation to the Data Link
Layer representation and finally (for Transaction Layer Packets) to the form that can be
processed by the Transaction Layer of the receiving device.
are formed in the Transaction and Data Link Layers to carry the information from the
transmitting component to the receiving component. As the transmitted packets flow
through the other layers, they are extended with additional information necessary to
handle packets at those layers. At the receiving side, the reverse process occurs and
packets get transformed from their Physical Layer representation to the Data Link
Layer representation and finally (for Transaction Layer Packets) to the form that can be
processed by the Transaction Layer of the receiving device.
Figure 2-2. PCI Express* Layering Diagram
Transaction
Data Link
Physical
Logical Sub-block
Electrical Sub-block
RX
TX
Transaction
Data Link
Physical
Logical Sub-block
Electrical Sub-block
RX
TX