ユーザーズマニュアル目次Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications1Contents3Figures3Tables4Revision History4Legal Lines and Disclaimers21.0 Introduction51.1 Design Flow5Figure 1. Thermal Design Process61.2 Definition of Terms7Table 1. Definition of Terms71.3 Reference Documents7Table 2. Referenced Documents82.0 Packaging Technology9Figure 2. Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)9Figure 3. Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)9Figure 4. Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)103.0 Thermal Specifications113.1 Thermal Design Power (TDP)113.2 Die Case Temperature11Table 3. Intel® 6321ESB I/O Controller Hub Thermal Specifications11Note: These specifications are based on silicon characterization; however, they may be updated as further data becomes available.114.0 Thermal Simulation125.0 Thermal Solution Requirements135.1 Characterizing the Thermal Solution Requirement13Equation 1. Case-to-Local Ambient Thermal Characterization Parameter (YCA)13Equation 2. Case-to-Local Ambient Thermal Characterization Parameter (YCA)13Figure 5. Processor Thermal Characterization Parameter Relationships14Example 1. Calculating the Required Thermal Performance141. Define a target component temperature TCASE and corresponding TDP.142. Define a target local ambient temperature, TLA.143. Use Equation 1 and Equation 2 to determine the required thermal performance needed to cool the device.14Table 4. Required Heat Sink Thermal Performance (YCA)156.0 Thermal Metrology166.1 Die Case Temperature Measurements166.1.1 Zero Degree Angle Attach Methodology161. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of the heatsink base.162. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 7).163. Attach thermal interface material (TIM) to the bottom of the heatsink base.164. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.165. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die usin...166. Attach heatsink assembly to the MCH and route thermocouple wires out through the milled slot.16Figure 6. Thermal Solution Decision Flowchart17Figure 7. Zero Degree Angle Attach Heatsink Modifications17Figure 8. Zero Degree Angle Attach Methodology (Top View)187.0 Reference Thermal Solution197.1 Operating Environment197.2 Heatsink Performance19Figure 9. Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target at 65C Local-Ambient207.3 Mechanical Design Envelope20Figure 10. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub217.4 Board-Level Components Keepout Dimensions217.5 Torsional Clip Heatsink Thermal Solution Assembly22Figure 11. Torsional Clip Heatsink Board Component Keepout237.5.1 Heatsink Orientation23Figure 12. Torsional Clip Heatsink Assembly247.5.2 Mechanical Interface Material247.5.3 Thermal Interface Material24Note: Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it reaches its phase change temperature.247.5.3.1 Effect of Pressure on TIM Performance24Table 5. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure257.5.4 Heatsink Clip257.5.5 Clip Retention Anchors258.0 Reliability Guidelines26Table 6. Reliability Guidelines26Appendix A Thermal Solution Component Suppliers27A.1 Torsional Clip Heatsink Thermal Solution27Appendix B Mechanical Drawings28Table 7. Mechanical Drawing List28Figure 13. Torsional Clip Heatsink Assembly Drawing29Figure 14. Torsional Clip Heatsink Drawing30Figure 15. Heat Sink Foam Gasket Drawing31Figure 16. Torsional Clip Drawing32サイズ: 817KBページ数: 32Language: Englishマニュアルを開く