Инструкции для Intel 632xESB

Содержание

• Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

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  • Contents

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    • Figures

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    • Tables

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  • Revision History

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  • Legal Lines and Disclaimers

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• 1.0 Introduction

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  • 1.1 Design Flow

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    • Figure 1. Thermal Design Process

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  • 1.2 Definition of Terms

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    • Table 1. Definition of Terms

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  • 1.3 Reference Documents

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    • Table 2. Referenced Documents

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• 2.0 Packaging Technology

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  • Figure 2. Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)

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  • Figure 3. Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)

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  • Figure 4. Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)

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• 3.0 Thermal Specifications

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  • 3.1 Thermal Design Power (TDP)

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  • 3.2 Die Case Temperature

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    • Table 3. Intel® 6321ESB I/O Controller Hub Thermal Specifications

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      • Note: These specifications are based on silicon characterization; however, they may be updated as further data becomes available.

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• 4.0 Thermal Simulation

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• 5.0 Thermal Solution Requirements

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  • 5.1 Characterizing the Thermal Solution Requirement

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    • Equation 1. Case-to-Local Ambient Thermal Characterization Parameter (YCA)

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    • Equation 2. Case-to-Local Ambient Thermal Characterization Parameter (YCA)

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    • Figure 5. Processor Thermal Characterization Parameter Relationships

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    • Example 1. Calculating the Required Thermal Performance

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      • 1. Define a target component temperature TCASE and corresponding TDP.

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      • 2. Define a target local ambient temperature, TLA.

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      • 3. Use Equation 1 and Equation 2 to determine the required thermal performance needed to cool the device.

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    • Table 4. Required Heat Sink Thermal Performance (YCA)

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• 6.0 Thermal Metrology

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  • 6.1 Die Case Temperature Measurements

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    • 6.1.1 Zero Degree Angle Attach Methodology

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      • 1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of the heatsink base.

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      • 2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 7).

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      • 3. Attach thermal interface material (TIM) to the bottom of the heatsink base.

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      • 4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.

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      • 5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die usin...

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      • 6. Attach heatsink assembly to the MCH and route thermocouple wires out through the milled slot.

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      • Figure 6. Thermal Solution Decision Flowchart

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      • Figure 7. Zero Degree Angle Attach Heatsink Modifications

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      • Figure 8. Zero Degree Angle Attach Methodology (Top View)

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• 7.0 Reference Thermal Solution

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  • 7.1 Operating Environment

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  • 7.2 Heatsink Performance

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    • Figure 9. Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target at 65C Local-Ambient

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  • 7.3 Mechanical Design Envelope

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    • Figure 10. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub

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  • 7.4 Board-Level Components Keepout Dimensions

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  • 7.5 Torsional Clip Heatsink Thermal Solution Assembly

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    • Figure 11. Torsional Clip Heatsink Board Component Keepout

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    • 7.5.1 Heatsink Orientation

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      • Figure 12. Torsional Clip Heatsink Assembly

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    • 7.5.2 Mechanical Interface Material

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    • 7.5.3 Thermal Interface Material

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      • Note: Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it reaches its phase change temperature.

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      • 7.5.3.1 Effect of Pressure on TIM Performance

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        • Table 5. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure

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    • 7.5.4 Heatsink Clip

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    • 7.5.5 Clip Retention Anchors

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• 8.0 Reliability Guidelines

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  • Table 6. Reliability Guidelines

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• Appendix A Thermal Solution Component Suppliers

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  • A.1 Torsional Clip Heatsink Thermal Solution

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• Appendix B Mechanical Drawings

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  • Table 7. Mechanical Drawing List

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  • Figure 13. Torsional Clip Heatsink Assembly Drawing

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  • Figure 14. Torsional Clip Heatsink Drawing

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  • Figure 15. Heat Sink Foam Gasket Drawing

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  • Figure 16. Torsional Clip Drawing

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