Rigado Inc. 04 マニュアル

目次

• FEATURES

  1
• APPLICATIONS

  1
• ORDERING INFORMATION

  2
• BLOCK DIAGRAM

  2
• QUICK SPECIFICATIONS

  4
• PIN DESCRIPTIONS

  5
• RIGDFU PIN FUNCTIONS

  6
• BMDWARE PIN FUNCTIONS

  7
• ELECTRICAL SPECIFICATIONS

  8
• ABSOLUTE MAXIMUM RATINGS

  8
• OPERATING CONDITIONS

  8
• GENERAL PURPOSE I/O

  8
• DEBUG & PROGRAMMING

  9
• CLOCKS

  9
• FIRMWARE

  10
• FACTORY IMAGE

  10
• Firmware Version ‘AA’

  10
• SOFTDEVICES

  10
• S132

  10
• S212

  11
• S332

  11
• MAC ADDRESS INFO

  12
• MECHANICAL DATA

  13
• BMD-300 DIMENSIONS

  13
• BMD-301 DIMENSIONS

  13
• RECOMMENDED PCB LAND PAD

  14
• MODULE MARKING

  14
• BMD-300 MODULE MARKING

  14
• BMD-301 MODULE MARKING

  15
• RF DESIGN NOTES

  15
• RECOMMENDED RF LAYOUT & GROUND PLANE

  15
• MECHANICAL ENCLOSURE

  16
• EVALUATION BOARDS

  16
• CUSTOM DEVELOPMENT

  16
• BLUETOOTH QUALIFICATION (PENDING)

  17
• REGULATORY STATEMENTS

  17
• FCC STATEMENT:

  17
• FCC IMPORTANT NOTES:

  17
• IC STATEMENT:

  19
• IC IMPORTANT NOTES:

  19
• CE REGULATORY:

  20
• JAPAN (MIC)

  20
• AUSTRALIA / NEW ZEALAND

  21
• APPROVED EXTERNAL ANTENNAS

  21
• SOLDER REFLOW TEMPERATURE-TIME PROFILE

  21
• MOISTURE SENSITIVITY LEVEL

  21
• PACKAGING AND LABELING

  22
• CARRIER TAPE DIMENSIONS

  22
• REEL PACKAGING

  22
• PACKAGING LABEL

  23
• CAUTIONS

  24
• LIFE SUPPORT POLICY

  24
• DOCUMENT HISTORY

  24
• RELATED DOCUMENTS

  25