Rigado Inc. 04 사용자 매뉴얼

차례

• FEATURES

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• APPLICATIONS

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• ORDERING INFORMATION

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• BLOCK DIAGRAM

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• QUICK SPECIFICATIONS

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• PIN DESCRIPTIONS

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• RIGDFU PIN FUNCTIONS

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• BMDWARE PIN FUNCTIONS

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• ELECTRICAL SPECIFICATIONS

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• ABSOLUTE MAXIMUM RATINGS

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• OPERATING CONDITIONS

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• GENERAL PURPOSE I/O

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• DEBUG & PROGRAMMING

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• CLOCKS

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• FIRMWARE

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• FACTORY IMAGE

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• Firmware Version ‘AA’

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• SOFTDEVICES

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• S132

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• S212

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• S332

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• MAC ADDRESS INFO

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• MECHANICAL DATA

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• BMD-300 DIMENSIONS

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• BMD-301 DIMENSIONS

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• RECOMMENDED PCB LAND PAD

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• MODULE MARKING

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• BMD-300 MODULE MARKING

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• BMD-301 MODULE MARKING

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• RF DESIGN NOTES

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• RECOMMENDED RF LAYOUT & GROUND PLANE

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• MECHANICAL ENCLOSURE

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• EVALUATION BOARDS

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• CUSTOM DEVELOPMENT

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• BLUETOOTH QUALIFICATION (PENDING)

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• REGULATORY STATEMENTS

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• FCC STATEMENT:

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• FCC IMPORTANT NOTES:

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• IC STATEMENT:

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• IC IMPORTANT NOTES:

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• CE REGULATORY:

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• JAPAN (MIC)

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• AUSTRALIA / NEW ZEALAND

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• APPROVED EXTERNAL ANTENNAS

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• SOLDER REFLOW TEMPERATURE-TIME PROFILE

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• MOISTURE SENSITIVITY LEVEL

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• PACKAGING AND LABELING

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• CARRIER TAPE DIMENSIONS

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• REEL PACKAGING

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• PACKAGING LABEL

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• CAUTIONS

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• LIFE SUPPORT POLICY

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• DOCUMENT HISTORY

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• RELATED DOCUMENTS

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